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Discover 26 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Type | Voltage - Rated | Current - Supply | Impedance | Size / Dimension | Termination | Output Type | Sensitivity | S/N Ratio | Voltage Range | Port Location | Height (Max) | Shape | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Type | Voltage - Rated | Current - Supply | Impedance | Size / Dimension | Termination | Output Type | Sensitivity | S/N Ratio | Voltage Range | Port Location | Height (Max) | Shape | |
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Soberton Inc. |
4,855
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MICROPHONE
|
Tray | EM | Electret Condenser | 2V | 500μA | 2.2 kOhms | 0.236" Dia (6.00mm) | PC Pins | Analog | -44dB ±3dB @ 94dB SPL | 58dB | 1V ~ 10V | Top | 0.094" (2.40mm) | Circular | ||
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TDK InvenSense |
7,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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MIC MEMS ANALOG OMNI -38DB
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Tape & Reel (TR) | INMP404 | MEMS (Silicon) | - | 250μA | 200 Ohms | 0.132" L x 0.098" W (3.35mm x 2.50mm) | Solder Pads | Analog | -38dB ±3dB @ 94dB SPL | 62dB | 1.5V ~ 3.3V | Bottom | 0.039" (0.98mm) | Rectangular | ||
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TDK InvenSense |
8,057
|
3 days |
-
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MOQ: 1 MPQ: 1
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MIC MEMS ANALOG OMNI -38DB
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Cut Tape (CT) | INMP404 | MEMS (Silicon) | - | 250μA | 200 Ohms | 0.132" L x 0.098" W (3.35mm x 2.50mm) | Solder Pads | Analog | -38dB ±3dB @ 94dB SPL | 62dB | 1.5V ~ 3.3V | Bottom | 0.039" (0.98mm) | Rectangular | ||
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TDK InvenSense |
8,057
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MIC MEMS ANALOG OMNI -38DB
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Digi-Reel | INMP404 | MEMS (Silicon) | - | 250μA | 200 Ohms | 0.132" L x 0.098" W (3.35mm x 2.50mm) | Solder Pads | Analog | -38dB ±3dB @ 94dB SPL | 62dB | 1.5V ~ 3.3V | Bottom | 0.039" (0.98mm) | Rectangular | ||
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Soberton Inc. |
26,930
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MICROPHONE
|
Tray | EM | Electret Condenser | 2V | 500μA | - | 0.236" Dia (6.00mm) | Solder Pads | Analog | -42dB ±3dB @ 94dB SPL | 58dB | - | Top | 0.094" (2.40mm) | Circular | ||
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Soberton Inc. |
3,903
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MIC COND ANALOG OMNI
|
Tray | EM | Electret Condenser | 2V | 500μA | 2.2 kOhms | 0.236" Dia (6.00mm) | PC Pins | Analog | -42dB ±3dB @ 94dB SPL | 58dB | 1V ~ 10V | Top | 0.213" (5.40mm) | Circular | ||
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Soberton Inc. |
1,709
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MIC COND ANALOG OMNI
|
Tray | EM | Electret Condenser | 2V | 500μA | 2.2 kOhms | 0.236" Dia (6.00mm) | PC Pins | Analog | -43dB ±5dB @ 94dB SPL | 58dB | 1V ~ 10V | Top | 0.114" (2.90mm) | Circular | ||
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Soberton Inc. |
1,970
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MICROPHONE
|
Tray | EM | Electret Condenser | 2V | 500μA | 2.2 kOhms | 0.157" Dia (4.00mm) | Solder Pads | Analog | -44dB ±3dB @ 94dB SPL | 58dB | 1V ~ 10V | Top | 0.067" (1.70mm) | Circular | ||
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TDK InvenSense |
3,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS DIGITAL PDM OMNI -26DB
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Tape & Reel (TR) | INMP421 | MEMS (Silicon) | - | 650μA | - | 0.157" L x 0.118" W (4.00mm x 3.00mm) | Solder Pads | Digital，PDM | -26dB ±3dB @ 94dB SPL | 61dB | 1.62V ~ 3.63V | Bottom | 0.043" (1.10mm) | Rectangular | ||
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TDK InvenSense |
3,474
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MIC MEMS DIGITAL PDM OMNI -26DB
|
Cut Tape (CT) | INMP421 | MEMS (Silicon) | - | 650μA | - | 0.157" L x 0.118" W (4.00mm x 3.00mm) | Solder Pads | Digital，PDM | -26dB ±3dB @ 94dB SPL | 61dB | 1.62V ~ 3.63V | Bottom | 0.043" (1.10mm) | Rectangular | ||
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TDK InvenSense |
3,474
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS DIGITAL PDM OMNI -26DB
|
Digi-Reel | INMP421 | MEMS (Silicon) | - | 650μA | - | 0.157" L x 0.118" W (4.00mm x 3.00mm) | Solder Pads | Digital，PDM | -26dB ±3dB @ 94dB SPL | 61dB | 1.62V ~ 3.63V | Bottom | 0.043" (1.10mm) | Rectangular | ||
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Knowles |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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MIC SISONIC ZERO HEIGHT RF
|
Tape & Reel (TR) | SiSonic SP | MEMS (Silicon) | - | 160μA | 400 Ohms | 0.132" L x 0.098" W (3.35mm x 2.50mm) | Solder Pads | Analog | -38dB ±3dB @ 94dB SPL | 63dB | 1.5V ~ 3.6V | Bottom | 0.043" (1.10mm) | Rectangular | ||
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|
|
Knowles |
2,457
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MIC SISONIC ZERO HEIGHT RF
|
Cut Tape (CT) | SiSonic SP | MEMS (Silicon) | - | 160μA | 400 Ohms | 0.132" L x 0.098" W (3.35mm x 2.50mm) | Solder Pads | Analog | -38dB ±3dB @ 94dB SPL | 63dB | 1.5V ~ 3.6V | Bottom | 0.043" (1.10mm) | Rectangular | ||
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|
Knowles |
2,457
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MIC SISONIC ZERO HEIGHT RF
|
Digi-Reel | SiSonic SP | MEMS (Silicon) | - | 160μA | 400 Ohms | 0.132" L x 0.098" W (3.35mm x 2.50mm) | Solder Pads | Analog | -38dB ±3dB @ 94dB SPL | 63dB | 1.5V ~ 3.6V | Bottom | 0.043" (1.10mm) | Rectangular | ||
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Soberton Inc. |
123
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MIC COND ANALOG OMNI
|
Tray | EM | Electret Condenser | 2V | 500μA | 2.2 kOhms | 0.236" Dia (6.00mm) | Solder Pads | Analog | -43dB ±5dB @ 94dB SPL | 58dB | - | Top | 0.114" (2.90mm) | Circular | ||
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|
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Soberton Inc. |
46
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MICROPHONE COND ANALOG OMNI
|
Tray | EM | Electret Condenser | 2V | 500μA | 2.2 kOhms | 0.177" Dia (4.50mm) | Solder Pads | Analog | -42dB ±3dB @ 94dB SPL | 60dB | 1V ~ 10V | Top | 0.118" (3.00mm) | Circular | ||
|
|
|
Soberton Inc. |
80
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MIC COND ANALOG OMNI
|
Tray | EM | Electret Condenser | 2V | 500μA | 2.2 kOhms | 0.177" Dia (4.50mm) | Solder Pads | Analog | -42dB ±3dB @ 94dB SPL | 60dB | 1V ~ 10V | Top | 0.118" (3.00mm) | Circular | ||
|
|
|
Soberton Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
MIC COND ANALOG OMNI
|
Tray | EM | Electret Condenser | 2V | 500μA | - | 0.236" Dia (6.00mm) | Solder Pads | Analog | -43dB ±5dB | 60dB | - | Top | 0.205" (5.20mm) | Circular | ||
|
|
|
Soberton Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
MICROPHONE
|
Tape & Reel (TR) | EM | Electret Condenser | 2V | 500μA | - | 0.236" Dia (6.00mm) | Solder Pads | Analog | -43dB ±5dB @ 94dB SPL | 58dB | - | Top | 0.087" (2.20mm) | Circular | ||
|
|
|
Soberton Inc. |
77
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MICROPHONE
|
Cut Tape (CT) | EM | Electret Condenser | 2V | 500μA | - | 0.236" Dia (6.00mm) | Solder Pads | Analog | -43dB ±5dB @ 94dB SPL | 58dB | - | Top | 0.087" (2.20mm) | Circular |
