- Manufacturer:
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- Series:
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- Operating Temperature:
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- Mounting Type:
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- Features:
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- Termination:
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- Height Above Board:
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- Material Flammability Rating:
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- Contact Finish:
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- Contact Material:
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- Housing Material:
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- Connector/Contact Type:
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- FFC,FCB Thickness:
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- Locking Feature:
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- Actuator Material:
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- Selected conditions:
Discover 71 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Height Above Board | Material Flammability Rating | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC,FCB Thickness | Locking Feature | Actuator Material | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Height Above Board | Material Flammability Rating | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC,FCB Thickness | Locking Feature | Actuator Material | ||
Molex,LLC |
2,988
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC VERT 21POS 1.25MM PCB
|
Tray | 52045 | -40°C ~ 85°C | Through Hole | - | Kinked Pin | 0.315" (8.00mm) | UL94 V-0 | Tin | 0.049" (1.25mm) | 200V | Phosphor Bronze | Polybutylene Terephthalate (PBT),Polyester | FFC,FPC | Contacts,Vertical,1 Sided | 0.30mm | - | - | ||||
Omron Electronics Inc-EMC Div |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC TOP 21POS 0.50MM R/A
|
Tape & Reel (TR) | XF2L | -30°C ~ 85°C | Surface Mount,Right Angle | Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP),Halogen Free | FPC | Contacts,Top | 0.30mm | Slide Lock | Liquid Crystal Polymer (LCP),Halogen Free | ||||
Omron Electronics Inc-EMC Div |
1,246
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC TOP 21POS 0.50MM R/A
|
Cut Tape (CT) | XF2L | -30°C ~ 85°C | Surface Mount,Right Angle | Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP),Halogen Free | FPC | Contacts,Top | 0.30mm | Slide Lock | Liquid Crystal Polymer (LCP),Halogen Free | ||||
Omron Electronics Inc-EMC Div |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC TOP 21POS 0.50MM R/A
|
- | XF2L | -30°C ~ 85°C | Surface Mount,Right Angle | Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP),Halogen Free | FPC | Contacts,Top | 0.30mm | Slide Lock | Liquid Crystal Polymer (LCP),Halogen Free | ||||
Wurth Electronics Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BTM 21POS 0.5MM SMD R/A
|
Tape & Reel (TR) | WR-FPC | -25°C ~ 85°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Tin | 0.020" (0.50mm) | - | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FFC | Contacts,Bottom | 0.30mm | Flip Lock | Polyamide (PA6T),Nylon 6T | ||||
Wurth Electronics Inc. |
3,998
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BTM 21POS 0.5MM SMD R/A
|
Cut Tape (CT) | WR-FPC | -25°C ~ 85°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Tin | 0.020" (0.50mm) | - | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FFC | Contacts,Bottom | 0.30mm | Flip Lock | Polyamide (PA6T),Nylon 6T | ||||
Wurth Electronics Inc. |
3,998
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BTM 21POS 0.5MM SMD R/A
|
- | WR-FPC | -25°C ~ 85°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Tin | 0.020" (0.50mm) | - | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FFC | Contacts,Bottom | 0.30mm | Flip Lock | Polyamide (PA6T),Nylon 6T | ||||
Wurth Electronics Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC TOP 21POS 0.5MM SMD R/A
|
Tape & Reel (TR) | WR-FPC | -25°C ~ 85°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Tin | 0.020" (0.50mm) | - | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts,Top | 0.30mm | Flip Lock | Polyamide (PA6T),Nylon 6T | ||||
Wurth Electronics Inc. |
3,993
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC TOP 21POS 0.5MM SMD R/A
|
Cut Tape (CT) | WR-FPC | -25°C ~ 85°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Tin | 0.020" (0.50mm) | - | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts,Top | 0.30mm | Flip Lock | Polyamide (PA6T),Nylon 6T | ||||
Wurth Electronics Inc. |
3,993
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC TOP 21POS 0.5MM SMD R/A
|
- | WR-FPC | -25°C ~ 85°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Tin | 0.020" (0.50mm) | - | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts,Top | 0.30mm | Flip Lock | Polyamide (PA6T),Nylon 6T | ||||
Omron Electronics Inc-EMC Div |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 21POS 0.30MM R/A
|
Tape & Reel (TR) | XF2B | -30°C ~ 85°C | Surface Mount,Right Angle | - | Solder | 0.083" (2.10mm) | UL94 V-0 | Gold | 0.012" (0.30mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP),Halogen Free | FPC | Contacts,Top and Bottom | 0.20mm | Rotary Lock,Backlock | Liquid Crystal Polymer (LCP),Halogen Free | ||||
Omron Electronics Inc-EMC Div |
731
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 21POS 0.30MM R/A
|
Cut Tape (CT) | XF2B | -30°C ~ 85°C | Surface Mount,Right Angle | - | Solder | 0.083" (2.10mm) | UL94 V-0 | Gold | 0.012" (0.30mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP),Halogen Free | FPC | Contacts,Top and Bottom | 0.20mm | Rotary Lock,Backlock | Liquid Crystal Polymer (LCP),Halogen Free | ||||
Omron Electronics Inc-EMC Div |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 21POS 0.30MM R/A
|
- | XF2B | -30°C ~ 85°C | Surface Mount,Right Angle | - | Solder | 0.083" (2.10mm) | UL94 V-0 | Gold | 0.012" (0.30mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP),Halogen Free | FPC | Contacts,Top and Bottom | 0.20mm | Rotary Lock,Backlock | Liquid Crystal Polymer (LCP),Halogen Free | ||||
Omron Electronics Inc-EMC Div |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 21POS 0.50MM R/A
|
Cut Tape (CT) | XF2H | -30°C ~ 85°C | Surface Mount,Right Angle | Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | Tin Alloy | 0.020" (0.50mm) | 50V | Copper Alloy | Polyamide (PA46),Nylon 4/6 | FPC | Contacts,Top and Bottom | 0.30mm | Rotary Lock,Backlock | Liquid Crystal Polymer (LCP) | ||||
Omron Electronics Inc-EMC Div |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC TOP 21POS 0.50MM R/A
|
Tape & Reel (TR) | XF2L | -30°C ~ 85°C | Surface Mount,Right Angle | Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Tin Alloy | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | FPC | Contacts,Top | 0.30mm | Slide Lock | Liquid Crystal Polymer (LCP) | ||||
Omron Electronics Inc-EMC Div |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC TOP 21POS 0.50MM R/A
|
Cut Tape (CT) | XF2L | -30°C ~ 85°C | Surface Mount,Right Angle | Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Tin Alloy | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | FPC | Contacts,Top | 0.30mm | Slide Lock | Liquid Crystal Polymer (LCP) | ||||
Omron Electronics Inc-EMC Div |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 21POS 0.50MM R/A
|
Tape & Reel (TR) | XF2N | -30°C ~ 85°C | Surface Mount,Right Angle | Solder Retention | Solder | - | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | FPC | Contacts,Top and Bottom | 0.20mm | Rotary Lock,Backlock | Liquid Crystal Polymer (LCP) | ||||
Omron Electronics Inc-EMC Div |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 21POS 0.50MM R/A
|
Cut Tape (CT) | XF2N | -30°C ~ 85°C | Surface Mount,Right Angle | Solder Retention | Solder | - | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | FPC | Contacts,Top and Bottom | 0.20mm | Rotary Lock,Backlock | Liquid Crystal Polymer (LCP) | ||||
Omron Electronics Inc-EMC Div |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 21POS 0.50MM R/A
|
- | XF2N | -30°C ~ 85°C | Surface Mount,Right Angle | Solder Retention | Solder | - | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | FPC | Contacts,Top and Bottom | 0.20mm | Rotary Lock,Backlock | Liquid Crystal Polymer (LCP) | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 21POS 0.30MM R/A
|
Tray | FF02 | -40°C ~ 85°C | Surface Mount,Right Angle | Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Gold | 0.012" (0.30mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | FPC | Contacts,Bottom | 0.12mm | Flip Lock | Polyphenylene Sulfide (PPS) |