- Packaging:
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- Series:
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- Mounting Type:
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- Height Above Board:
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- Housing Material:
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- Connector/Contact Type:
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- Locking Feature:
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- Selected conditions:
Discover 8 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Mounting Type | Features | Height Above Board | Housing Material | Connector/Contact Type | Locking Feature | Actuator Material | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Mounting Type | Features | Height Above Board | Housing Material | Connector/Contact Type | Locking Feature | Actuator Material | ||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 30POS 0.50MM SMD
|
Tray | FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | Flip Lock | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 30POS 0.50MM R/A
|
Tray | FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | Flip Lock | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 30POS 0.50MM R/A
|
Tape & Reel (TR) | FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | Flip Lock | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 30POS 0.50MM SMD
|
Tape & Reel (TR) | FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | Flip Lock | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 30POS 0.50MM SMD
|
Tray | FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | Flip Lock | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 30POS 0.50MM R/A
|
Tray | IL-FPR | Surface Mount,Right Angle | Zero ion Force (ZIF) | 0.075" (1.90mm) | Polyphenylene Sulfide (PPS),Glass Filled | Contacts,Bottom | Slide Lock | Polyphenylene Sulfide (PPS),Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC VERT 30POS 0.50MM SMD
|
Tray | IL-FPR | Surface Mount | Zero ion Force (ZIF) | 0.154" (3.90mm) | Polyphenylene Sulfide (PPS),Glass Filled | Contacts,Vertical,1 Sided | Slide Lock | Polyphenylene Sulfide (PPS),Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC TOP 30POS 0.50MM R/A
|
Tray | IL-FPR | Surface Mount,Right Angle | Zero ion Force (ZIF) | 0.075" (1.90mm) | Polyphenylene Sulfide (PPS),Glass Filled | Contacts,Top | Slide Lock | Polyphenylene Sulfide (PPS),Glass Filled |