- Features:
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- Height Above Board:
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- Number of Positions:
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- Housing Material:
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- Connector/Contact Type:
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- FFC,FCB Thickness:
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- Locking Feature:
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- Cable End Type:
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- Selected conditions:
Discover 152 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Mounting Type | Features | Height Above Board | Number of Positions | Pitch | Housing Material | Connector/Contact Type | FFC,FCB Thickness | Locking Feature | Cable End Type | Actuator Material | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Mounting Type | Features | Height Above Board | Number of Positions | Pitch | Housing Material | Connector/Contact Type | FFC,FCB Thickness | Locking Feature | Cable End Type | Actuator Material | ||
JAE Electronics |
356
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 40POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 40 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
397
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 50 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
68
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 40POS 0.50MM SMD
|
FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | 40 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
70
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 45POS 0.30MM R/A
|
FF02S | Surface Mount,Right Angle | Zero ion Force (ZIF) | 0.035" (0.88mm) | 45 | 0.012" (0.30mm) | Liquid Crystal Polymer (LCP) | Contacts,Bottom | 0.12mm | Flip Lock | Straight | Polyphenylene Sulfide (PPS) | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 10POS 0.50MM SMD
|
FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | 10 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 10POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 10 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 15POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 15 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 16POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 16 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 22POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 22 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 20POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 20 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 8POS 0.50MM SMD
|
FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | 8 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 30POS 0.50MM SMD
|
FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | 30 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 30POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 30 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
24
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 24POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 24 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 45POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 45 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 55POS 0.30MM R/A
|
FF02S | Surface Mount,Right Angle | Zero ion Force (ZIF) | 0.035" (0.88mm) | 55 | 0.012" (0.30mm) | Liquid Crystal Polymer (LCP) | Contacts,Bottom | 0.12mm | Flip Lock | Straight | Polyphenylene Sulfide (PPS) | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM SMD
|
FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | 50 | 0.020" (0.50mm) | Liquid Crystal Polymer (LCP),Glass Filled | Contacts,Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 15POS 0.30MM R/A
|
FF02 | Surface Mount,Right Angle | Zero ion Force (ZIF) | 0.047" (1.20mm) | 15 | 0.012" (0.30mm) | Liquid Crystal Polymer (LCP) | Contacts,Bottom | 0.12mm | Flip Lock | Straight | Polyphenylene Sulfide (PPS) | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 21POS 0.30MM R/A
|
FF02 | Surface Mount,Right Angle | Zero ion Force (ZIF) | 0.047" (1.20mm) | 21 | 0.012" (0.30mm) | Liquid Crystal Polymer (LCP) | Contacts,Bottom | 0.12mm | Flip Lock | Straight | Polyphenylene Sulfide (PPS) | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 29POS 0.30MM R/A
|
FF02 | Surface Mount,Right Angle | Zero ion Force (ZIF) | 0.047" (1.20mm) | 29 | 0.012" (0.30mm) | Liquid Crystal Polymer (LCP) | Contacts,Bottom | 0.12mm | Flip Lock | Straight | Polyphenylene Sulfide (PPS) |