- Series:
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- Mounting Type:
-
- Height Above Board:
-
- Number of Positions:
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- FFC,FCB Thickness:
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Discover 35 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Mounting Type | Features | Height Above Board | Number of Positions | Pitch | FFC,FCB Thickness | Actuator Material | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Mounting Type | Features | Height Above Board | Number of Positions | Pitch | FFC,FCB Thickness | Actuator Material | ||
JAE Electronics |
356
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 40POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 40 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
397
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 50 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
68
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 40POS 0.50MM SMD
|
FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | 40 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 10POS 0.50MM SMD
|
FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | 10 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 10POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 10 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 15POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 15 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 16POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 16 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 22POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 22 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 20POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 20 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 8POS 0.50MM SMD
|
FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | 8 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 30POS 0.50MM SMD
|
FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | 30 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 30POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 30 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
24
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 24POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 24 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 45POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 45 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM SMD
|
FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | 50 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM SMD
|
FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | 50 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 8POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 8 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 18POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 18 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 6POS 0.50MM SMD
|
FA5 | Board Edge,Cutout | Solder Retention,Zero ion Force (ZIF) | - | 6 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 6POS 0.50MM R/A
|
FA5 | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | 0.057" (1.45mm) | 6 | 0.020" (0.50mm) | 0.30mm | Polyamide (PA),Nylon,Glass Filled |