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- Operating Temperature：
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- Number of Positions：
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Discover 89 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Features | Number of Positions | Contact Finish | Housing Material | Actuator Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Features | Number of Positions | Contact Finish | Housing Material | Actuator Material | |
|
|
|
Molex，LLC |
14,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 12POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 12 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
14,436
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 12POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 12 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
14,436
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 12POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 12 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
4,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 24POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 24 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
4,604
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 24POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 24 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
4,604
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 24POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 24 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
2,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 30POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 30 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
2,422
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 30POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 30 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
2,422
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 30POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 30 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
4,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 8 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
4,430
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 8 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
4,430
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 8 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
6,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 10 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
6,698
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 10 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
6,698
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 10 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
6,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 16POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 16 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
6,887
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 16POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 16 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
6,887
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 16POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 16 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
2,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 20POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 20 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
2,588
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 20POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 20 | Tin Bismuth | Polyamide (PA)，Nylon，Glass Filled | Polyphenylene Sulfide (PPS)，Glass Filled |
