- Operating Temperature:
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- Termination:
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- Height Above Board:
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- Material Flammability Rating:
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- Contact Material:
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- Housing Material:
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- FFC,FCB Thickness:
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- Locking Feature:
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- Cable End Type:
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- Selected conditions:
Discover 23 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Features | Termination | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | FFC,FCB Thickness | Locking Feature | Cable End Type | Actuator Material | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Features | Termination | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | FFC,FCB Thickness | Locking Feature | Cable End Type | Actuator Material | ||
Amphenol FCI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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CONN FPC BOTTOM 4POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 4 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 9POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 9 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 4 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 4 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 5POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 5 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 5POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 5 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 7POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 7 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 7POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 7 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN BOTTOM 6POS 0.5MM SMD R/A
|
- | - | - | - | - | 6 | - | - | - | - | - | - | - | - | - | ||||
Amphenol FCI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 9POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 9 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 6POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 6 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 5POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 5 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 6POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 6 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 8POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 8 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 8POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 8 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 13POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 13 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 12POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 12 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 12POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 12 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 13POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 13 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 4 | Gold | 50V | Copper Alloy | Thermoplastic | FPC | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic |