- Manufacturer：
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- Series：
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- Operating Temperature：
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- Features：
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- Height Above Board：
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- Material Flammability Rating：
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- Number of Positions：
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- Contact Finish：
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- Pitch：
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- Contact Material：
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- Housing Material：
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- Flat Flex Type：
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- FFC，FCB Thickness：
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- Locking Feature：
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- Actuator Material：
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Discover 751 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Features | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | FFC，FCB Thickness | Locking Feature | Actuator Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Features | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | FFC，FCB Thickness | Locking Feature | Actuator Material | |
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|
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AVX Corp/Kyocera Corp |
8,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
Tape & Reel (TR) | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
10,659
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
Cut Tape (CT) | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
10,659
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
- | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
6,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
Tape & Reel (TR) | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 10 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
7,085
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
Cut Tape (CT) | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 10 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
7,085
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
- | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 10 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
2,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 12POS 0.50MM R/A
|
Tape & Reel (TR) | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 12 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
3,941
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 12POS 0.50MM R/A
|
Cut Tape (CT) | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 12 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
3,941
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 12POS 0.50MM R/A
|
- | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 12 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
22,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 30POS 0.50MM R/A
|
Tape & Reel (TR) | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
27,037
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 30POS 0.50MM R/A
|
Cut Tape (CT) | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
27,037
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 30POS 0.50MM R/A
|
- | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
8,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 50POS 0.50MM R/A
|
Tape & Reel (TR) | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
10,333
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 50POS 0.50MM R/A
|
Cut Tape (CT) | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
10,333
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 50POS 0.50MM R/A
|
- | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
Molex，LLC |
6,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM R/A
|
Tape & Reel (TR) | Easy-On 502790 | -20°C ~ 85°C | Double Contact，Solder Retention，Zero ion Force (ZIF) | 0.098" (2.50mm) | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | 0.30mm | Flip Lock | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
6,686
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM R/A
|
Cut Tape (CT) | Easy-On 502790 | -20°C ~ 85°C | Double Contact，Solder Retention，Zero ion Force (ZIF) | 0.098" (2.50mm) | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | 0.30mm | Flip Lock | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
6,686
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM R/A
|
- | Easy-On 502790 | -20°C ~ 85°C | Double Contact，Solder Retention，Zero ion Force (ZIF) | 0.098" (2.50mm) | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | 0.30mm | Flip Lock | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
AVX Corp/Kyocera Corp |
4,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 60POS 0.50MM R/A
|
Tape & Reel (TR) | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 60 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
4,890
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 60POS 0.50MM R/A
|
Cut Tape (CT) | 6288，Kyocera | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 60 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | 0.30mm | Flip Lock | - |
