- Manufacturer:
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- Packaging:
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- Series:
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- Operating Temperature:
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- Mounting Type:
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- Features:
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- Termination:
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- Height Above Board:
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- Material Flammability Rating:
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- Contact Finish:
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- Pitch:
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- Contact Material:
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- Housing Material:
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- Flat Flex Type:
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- Connector/Contact Type:
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- FFC,FCB Thickness:
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- Locking Feature:
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- Selected conditions:
Discover 49 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Height Above Board | Material Flammability Rating | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC,FCB Thickness | Locking Feature | Actuator Material | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Height Above Board | Material Flammability Rating | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC,FCB Thickness | Locking Feature | Actuator Material | ||
Molex,LLC |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 33POS 0.50MM R/A
|
Tape & Reel (TR) | Easy-On 502244 | -25°C ~ 85°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.092" (2.33mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP),Glass Filled | FFC | Contacts,Bottom | 0.30mm | Flip Lock | Polyamide (PA),Nylon,Glass Filled | ||||
Molex,LLC |
2,015
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 33POS 0.50MM R/A
|
Cut Tape (CT) | Easy-On 502244 | -25°C ~ 85°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.092" (2.33mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP),Glass Filled | FFC | Contacts,Bottom | 0.30mm | Flip Lock | Polyamide (PA),Nylon,Glass Filled | ||||
Molex,LLC |
2,015
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 33POS 0.50MM R/A
|
- | Easy-On 502244 | -25°C ~ 85°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.092" (2.33mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP),Glass Filled | FFC | Contacts,Bottom | 0.30mm | Flip Lock | Polyamide (PA),Nylon,Glass Filled | ||||
Molex,LLC |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC VERT 33POS 0.50MM SMD
|
Tape & Reel (TR) | Easy-On 502231 | -25°C ~ 85°C | Surface Mount | Solder Retention,Zero ion Force (ZIF) | Solder | 0.238" (6.05mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP),Glass Filled | FFC | Contacts,Vertical,1 Sided | 0.30mm | Flip Lock | Polyamide (PA9T),Nylon 9T,Glass Filled | ||||
Molex,LLC |
1,759
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC VERT 33POS 0.50MM SMD
|
Cut Tape (CT) | Easy-On 502231 | -25°C ~ 85°C | Surface Mount | Solder Retention,Zero ion Force (ZIF) | Solder | 0.238" (6.05mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP),Glass Filled | FFC | Contacts,Vertical,1 Sided | 0.30mm | Flip Lock | Polyamide (PA9T),Nylon 9T,Glass Filled | ||||
Molex,LLC |
1,759
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC VERT 33POS 0.50MM SMD
|
- | Easy-On 502231 | -25°C ~ 85°C | Surface Mount | Solder Retention,Zero ion Force (ZIF) | Solder | 0.238" (6.05mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP),Glass Filled | FFC | Contacts,Vertical,1 Sided | 0.30mm | Flip Lock | Polyamide (PA9T),Nylon 9T,Glass Filled | ||||
Omron Electronics Inc-EMC Div |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Tape & Reel (TR) | XF2B | -30°C ~ 85°C | Surface Mount,Right Angle | - | Solder | 0.083" (2.10mm) | UL94 V-0 | Gold | 0.012" (0.30mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP),Halogen Free | FPC | Contacts,Top and Bottom | 0.20mm | Rotary Lock,Backlock | Liquid Crystal Polymer (LCP),Halogen Free | ||||
Omron Electronics Inc-EMC Div |
851
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 33POS 0.30MM R/A
|
Cut Tape (CT) | XF2B | -30°C ~ 85°C | Surface Mount,Right Angle | - | Solder | 0.083" (2.10mm) | UL94 V-0 | Gold | 0.012" (0.30mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP),Halogen Free | FPC | Contacts,Top and Bottom | 0.20mm | Rotary Lock,Backlock | Liquid Crystal Polymer (LCP),Halogen Free | ||||
Wurth Electronics Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN .5MM HORZ BOTTOM SMD 33POS
|
Tape & Reel (TR) | WR-FPC | -40°C ~ 105°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.087" (2.20mm) | UL94 V-0 | Tin | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA6T),Nylon 6T | FFC,FPC | Contacts,Bottom | 0.30mm | Flip Lock | Polyamide (PA6T),Nylon 6T | ||||
Wurth Electronics Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN .5MM HORZ BOTTOM SMD 33POS
|
Cut Tape (CT) | WR-FPC | -40°C ~ 105°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.087" (2.20mm) | UL94 V-0 | Tin | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA6T),Nylon 6T | FFC,FPC | Contacts,Bottom | 0.30mm | Flip Lock | Polyamide (PA6T),Nylon 6T | ||||
Wurth Electronics Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN .5MM HORZ BOTTOM SMD 33POS
|
- | WR-FPC | -40°C ~ 105°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.087" (2.20mm) | UL94 V-0 | Tin | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA6T),Nylon 6T | FFC,FPC | Contacts,Bottom | 0.30mm | Flip Lock | Polyamide (PA6T),Nylon 6T | ||||
Hirose Electric Co Ltd |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC TOP 33POS 0.50MM R/A
|
Tape & Reel (TR) | FH12 | -40°C ~ 85°C | Surface Mount,Right Angle | Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | Tin-Lead | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA),Nylon | FFC,FPC | Contacts,Top | 0.30mm | Flip Lock | Polyphenylene Sulfide (PPS) | ||||
Hirose Electric Co Ltd |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC TOP 33POS 0.50MM R/A
|
Cut Tape (CT) | FH12 | -40°C ~ 85°C | Surface Mount,Right Angle | Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | Tin-Lead | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA),Nylon | FFC,FPC | Contacts,Top | 0.30mm | Flip Lock | Polyphenylene Sulfide (PPS) | ||||
JAE Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Tray | FF02 | -40°C ~ 85°C | Surface Mount,Right Angle | Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Gold | 0.012" (0.30mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP) | FPC | Contacts,Bottom | 0.12mm | Flip Lock | Polyphenylene Sulfide (PPS) | ||||
Hirose Electric Co Ltd |
8,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 33POS 0.50MM R/A
|
Tape & Reel (TR) | FH12 | -40°C ~ 85°C | Surface Mount,Right Angle | Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA),Nylon | FFC,FPC | Contacts,Bottom | 0.30mm | Flip Lock | Polyphenylene Sulfide (PPS) | ||||
Hirose Electric Co Ltd |
8,916
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 33POS 0.50MM R/A
|
Cut Tape (CT) | FH12 | -40°C ~ 85°C | Surface Mount,Right Angle | Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA),Nylon | FFC,FPC | Contacts,Bottom | 0.30mm | Flip Lock | Polyphenylene Sulfide (PPS) | ||||
Hirose Electric Co Ltd |
8,916
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 33POS 0.50MM R/A
|
- | FH12 | -40°C ~ 85°C | Surface Mount,Right Angle | Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA),Nylon | FFC,FPC | Contacts,Bottom | 0.30mm | Flip Lock | Polyphenylene Sulfide (PPS) | ||||
TE Connectivity AMP Connectors |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.50MM R/A
|
Tape & Reel (TR) | - | -20°C ~ 85°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.081" (2.05mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 250V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts,Bottom | 0.30mm | Flip Lock | Liquid Crystal Polymer (LCP) | ||||
TE Connectivity AMP Connectors |
1,693
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.50MM R/A
|
Cut Tape (CT) | - | -20°C ~ 85°C | Surface Mount,Right Angle | Solder Retention,Zero ion Force (ZIF) | Solder | 0.081" (2.05mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 250V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts,Bottom | 0.30mm | Flip Lock | Liquid Crystal Polymer (LCP) | ||||
Hirose Electric Co Ltd |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC VERT 33POS 0.50MM SMD
|
Tape & Reel (TR) | FH12 | -40°C ~ 85°C | Surface Mount | Solder Retention,Zero ion Force (ZIF) | Solder | 0.142" (3.60mm) | UL94 V-0 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA),Nylon | FFC,FPC | Contacts,Vertical,1 Sided | 0.30mm | Flip Lock | Polyphenylene Sulfide (PPS) |