- Manufacturer：
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- Series：
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- Operating Temperature：
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- Mounting Type：
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- Features：
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- Termination：
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- Height Above Board：
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- Material Flammability Rating：
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- Number of Positions：
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- Contact Finish：
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- Pitch：
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- Voltage Rating：
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- Contact Material：
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- Housing Material：
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- Flat Flex Type：
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- FFC，FCB Thickness：
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- Locking Feature：
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- Actuator Material：
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Discover 2,044 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | FFC，FCB Thickness | Locking Feature | Actuator Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | FFC，FCB Thickness | Locking Feature | Actuator Material | |
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Amphenol FCI |
22,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 12POS 0.50MM R/A
|
Tape & Reel (TR) | VLL | -55°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.051" (1.30mm) | UL94 V-0 | 12 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | 0.30mm | Flip Lock，Backlock | Polyamide (PA9T)，Nylon 9T，Glass Filled | ||
|
|
|
Amphenol FCI |
26,624
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 12POS 0.50MM R/A
|
Cut Tape (CT) | VLL | -55°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.051" (1.30mm) | UL94 V-0 | 12 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | 0.30mm | Flip Lock，Backlock | Polyamide (PA9T)，Nylon 9T，Glass Filled | ||
|
|
|
Amphenol FCI |
26,624
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 12POS 0.50MM R/A
|
- | VLL | -55°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.051" (1.30mm) | UL94 V-0 | 12 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | 0.30mm | Flip Lock，Backlock | Polyamide (PA9T)，Nylon 9T，Glass Filled | ||
|
|
|
Amphenol FCI |
22,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM R/A
|
Tape & Reel (TR) | OPU | -55°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA9T)，Nylon 9T，Glass Filled | FPC | 0.30mm | Slide Lock | Thermoplastic，Glass Filled | ||
|
|
|
Amphenol FCI |
23,921
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM R/A
|
Cut Tape (CT) | OPU | -55°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA9T)，Nylon 9T，Glass Filled | FPC | 0.30mm | Slide Lock | Thermoplastic，Glass Filled | ||
|
|
|
Amphenol FCI |
23,921
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM R/A
|
- | OPU | -55°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA9T)，Nylon 9T，Glass Filled | FPC | 0.30mm | Slide Lock | Thermoplastic，Glass Filled | ||
|
|
|
Molex，LLC |
6,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS 1.00MM R/A
|
Tape & Reel (TR) | 52271 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.118" (3.00mm) | UL94 V-0 | 4 | Tin Bismuth | 0.039" (1.00mm) | 50V | Phosphor Bronze | Polyamide (PA46)，Nylon 4/6 | FPC | 0.30mm | Slide Lock | Polyphenylene Sulfide (PPS) | ||
|
|
|
Molex，LLC |
7,267
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS 1.00MM R/A
|
Cut Tape (CT) | 52271 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.118" (3.00mm) | UL94 V-0 | 4 | Tin Bismuth | 0.039" (1.00mm) | 50V | Phosphor Bronze | Polyamide (PA46)，Nylon 4/6 | FPC | 0.30mm | Slide Lock | Polyphenylene Sulfide (PPS) | ||
|
|
|
Molex，LLC |
7,267
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS 1.00MM R/A
|
- | 52271 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.118" (3.00mm) | UL94 V-0 | 4 | Tin Bismuth | 0.039" (1.00mm) | 50V | Phosphor Bronze | Polyamide (PA46)，Nylon 4/6 | FPC | 0.30mm | Slide Lock | Polyphenylene Sulfide (PPS) | ||
|
|
|
Amphenol FCI |
2,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 40POS 0.50MM R/A
|
Tape & Reel (TR) | OPU | -55°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA9T)，Nylon 9T，Glass Filled | FPC | 0.30mm | Slide Lock | Thermoplastic，Glass Filled | ||
|
|
|
Amphenol FCI |
2,989
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 40POS 0.50MM R/A
|
Cut Tape (CT) | OPU | -55°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA9T)，Nylon 9T，Glass Filled | FPC | 0.30mm | Slide Lock | Thermoplastic，Glass Filled | ||
|
|
|
Amphenol FCI |
2,989
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 40POS 0.50MM R/A
|
- | OPU | -55°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA9T)，Nylon 9T，Glass Filled | FPC | 0.30mm | Slide Lock | Thermoplastic，Glass Filled | ||
|
|
|
JST Sales America Inc. |
2,800
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
Tape & Reel (TR) | FLZ | -25°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | 8 | Tin | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA6T)，Nylon 6T | FFC，FPC | 0.30mm | Slide Lock | Polyamide (PA6T)，Nylon 6T | ||
|
|
|
JST Sales America Inc. |
3,102
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
Cut Tape (CT) | FLZ | -25°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | 8 | Tin | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA6T)，Nylon 6T | FFC，FPC | 0.30mm | Slide Lock | Polyamide (PA6T)，Nylon 6T | ||
|
|
|
JST Sales America Inc. |
3,102
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
- | FLZ | -25°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.079" (2.00mm) | UL94 V-0 | 8 | Tin | 0.020" (0.50mm) | 50V | Phosphor Bronze | Polyamide (PA6T)，Nylon 6T | FFC，FPC | 0.30mm | Slide Lock | Polyamide (PA6T)，Nylon 6T | ||
|
|
|
Molex，LLC |
4,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 6POS 1.00MM R/A
|
Tape & Reel (TR) | 52271 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.118" (3.00mm) | UL94 V-0 | 6 | Tin Bismuth | 0.039" (1.00mm) | 50V | Phosphor Bronze | Polyamide (PA46)，Nylon 4/6 | FPC | 0.30mm | Slide Lock | Polyphenylene Sulfide (PPS) | ||
|
|
|
Molex，LLC |
5,412
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 6POS 1.00MM R/A
|
Cut Tape (CT) | 52271 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.118" (3.00mm) | UL94 V-0 | 6 | Tin Bismuth | 0.039" (1.00mm) | 50V | Phosphor Bronze | Polyamide (PA46)，Nylon 4/6 | FPC | 0.30mm | Slide Lock | Polyphenylene Sulfide (PPS) | ||
|
|
|
Molex，LLC |
5,412
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 6POS 1.00MM R/A
|
- | 52271 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.118" (3.00mm) | UL94 V-0 | 6 | Tin Bismuth | 0.039" (1.00mm) | 50V | Phosphor Bronze | Polyamide (PA46)，Nylon 4/6 | FPC | 0.30mm | Slide Lock | Polyphenylene Sulfide (PPS) | ||
|
|
|
Molex，LLC |
7,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS 1.00MM R/A
|
Tape & Reel (TR) | 52271 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.118" (3.00mm) | UL94 V-0 | 4 | Gold | 0.039" (1.00mm) | 50V | Phosphor Bronze | Polyamide (PA46)，Nylon 4/6 | FPC | 0.30mm | Slide Lock | Polyphenylene Sulfide (PPS) | ||
|
|
|
Molex，LLC |
7,882
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS 1.00MM R/A
|
Cut Tape (CT) | 52271 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.118" (3.00mm) | UL94 V-0 | 4 | Gold | 0.039" (1.00mm) | 50V | Phosphor Bronze | Polyamide (PA46)，Nylon 4/6 | FPC | 0.30mm | Slide Lock | Polyphenylene Sulfide (PPS) |
