- Manufacturer：
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- Packaging：
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- Operating Temperature：
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- Height Above Board：
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- Number of Positions：
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- Contact Finish：
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- Locking Feature：
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Discover 129 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Features | Height Above Board | Number of Positions | Contact Finish | Locking Feature | Actuator Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Features | Height Above Board | Number of Positions | Contact Finish | Locking Feature | Actuator Material | |
|
|
|
Molex，LLC |
18,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC/FPC BOTTOM 40P .5MM R/A
|
Tape & Reel (TR) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 40 | Gold | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
18,803
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC/FPC BOTTOM 40P .5MM R/A
|
Cut Tape (CT) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 40 | Gold | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
18,803
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC/FPC BOTTOM 40P .5MM R/A
|
- | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 40 | Gold | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
3,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS .5MM R/A
|
Tape & Reel (TR) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 4 | Gold | Flip Lock，Backlock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
3,428
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS .5MM R/A
|
Cut Tape (CT) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 4 | Gold | Flip Lock，Backlock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
3,428
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS .5MM R/A
|
- | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 4 | Gold | Flip Lock，Backlock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
3,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 10POS .5MM R/A
|
Tape & Reel (TR) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 10 | Gold | Flip Lock，Backlock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
5,983
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 10POS .5MM R/A
|
Cut Tape (CT) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 10 | Gold | Flip Lock，Backlock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
5,983
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 10POS .5MM R/A
|
- | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 10 | Gold | Flip Lock，Backlock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
3,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 12POS .5MM R/A
|
Tape & Reel (TR) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 12 | Gold | Flip Lock，Backlock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
3,956
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 12POS .5MM R/A
|
Cut Tape (CT) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 12 | Gold | Flip Lock，Backlock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
3,956
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 12POS .5MM R/A
|
- | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 12 | Gold | Flip Lock，Backlock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
6,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC/FPC BOTTOM 20P .5MM R/A
|
Tape & Reel (TR) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 20 | Gold | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
6,161
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC/FPC BOTTOM 20P .5MM R/A
|
Cut Tape (CT) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 20 | Gold | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
6,161
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC/FPC BOTTOM 20P .5MM R/A
|
- | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 20 | Gold | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
3,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC/FPC BOTTOM 30P .5MM R/A
|
Tape & Reel (TR) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 30 | Gold | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
3,361
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC/FPC BOTTOM 30P .5MM R/A
|
Cut Tape (CT) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 30 | Gold | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
3,361
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC/FPC BOTTOM 30P .5MM R/A
|
- | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 30 | Gold | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
6,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC/FPC BOTTOM 50P .5MM R/A
|
Tape & Reel (TR) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 50 | Gold | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
8,346
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC/FPC BOTTOM 50P .5MM R/A
|
Cut Tape (CT) | Easy-On 505110 | -40°C ~ 105°C | Solder Retention，Zero ion Force (ZIF) | 0.075" (1.90mm) | 50 | Gold | Flip Lock | Polyamide (PA)，Nylon，Glass Filled |
