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Discover 5,617 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Mill-Max Manufacturing Corp. |
28,542
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS GOLD
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Tube | 110 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
8,743
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 6POS GOLD
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Tube | 110 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
3,743
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS GOLD
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Tube | 115 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
3,668
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 24POS TIN
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Tube | 110 | Through Hole | DIP，0.4" (10.16mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
8,629
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 14POS GOLD
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Tube | 110 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
4,338
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 14POS GOLD
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Tube | 110 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
2,842
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 44POS TIN
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Tube | 940 | Surface Mount | PLCC | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.050" (1.27mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
2,567
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 44POS TIN
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Tube | 940 | Through Hole | PLCC | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 44 (4 x 11) | 0.100" (2.54mm) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
20,612
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 16POS GOLD
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Tube | 110 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
6,589
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 16POS GOLD
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Tube | 110 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
1,677
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 18POS GOLD
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Tube | 110 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
4,745
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 52POS TIN
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Tube | 940 | Through Hole | PLCC | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 52 (4 x 13) | 0.100" (2.54mm) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
7,520
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 32POS TIN
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Tube | 110 | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 32 (2 x 16) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
5,288
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 210 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
1,065
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN TRANSIST TO-5 4POS GOLD
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Tube | 917 | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 4 (Round) | - | Gold | 30μin (0.76μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
4,108
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | 110 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
4,274
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
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Tube | 540 | Surface Mount | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 32 (2 x 7，2 x 9) | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Copper Alloy | ||
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Mill-Max Manufacturing Corp. |
2,785
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 22POS GOLD
|
Tube | 110 | Through Hole | DIP，0.4" (10.16mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
2,928
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | 110 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
4,311
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | 110 | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy |
