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Discover 53 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Series Operating Temperature Mounting Type Features Termination Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post
25-0513-10
Aries Electronics
3,340
3 days
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 513 - Through Hole - Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
25-0503-30
Aries Electronics
555
3 days
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 503 - Through Hole - Wire Wrap Polyamide (PA),Nylon,Glass Filled 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
25-0511-10
Aries Electronics
187
3 days
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS TIN
Bulk 511 -55°C ~ 105°C Through Hole - Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Tin 50μin (1.27μm) Phosphor Bronze 0.100" (2.54mm) Tin 50μin (1.27μm) Phosphor Bronze
346-93-125-41-013000
Mill-Max Manufacturing Corp.
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 346 -55°C ~ 125°C Through Hole - Press-Fit Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200μin (5.08μm) Brass Alloy
346-43-125-41-013000
Mill-Max Manufacturing Corp.
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 346 -55°C ~ 125°C Through Hole - Press-Fit Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass Alloy
714-43-125-31-018000
Mill-Max Manufacturing Corp.
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 714 -55°C ~ 125°C Through Hole - Solder Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Brass Alloy
25-0501-30
Aries Electronics
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS TIN
Bulk 501 -55°C ~ 105°C Through Hole - Wire Wrap Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Tin 200μin (5.08μm) Phosphor Bronze 0.100" (2.54mm) Tin 200μin (5.08μm) Phosphor Bronze
D01-9972542
Harwin Inc.
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk D01-997 -55°C ~ 125°C Through Hole - Solder Polycyclohexylenedimethylene Terephthalate (PCT),Glass Filled 0.100" (2.54mm) Gold Flash Beryllium Copper 0.100" (2.54mm) Tin 196.8μin (5.00μm) Brass
25-0518-10
Aries Electronics
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 518 - Through Hole Open Frame Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
25-0518-10T
Aries Electronics
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 518 - Through Hole Open Frame Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
25-0518-10H
Aries Electronics
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 518 - Through Hole Open Frame Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
25-0513-10T
Aries Electronics
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 513 - Through Hole - Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
25-0518-11
Aries Electronics
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 518 - Through Hole Open Frame Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Gold 10μin (0.25μm) Brass
25-0518-00
Aries Electronics
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 518 - Surface Mount Open Frame Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
25-0513-11
Aries Electronics
Inquiry
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-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 513 - Through Hole - Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Gold 10μin (0.25μm) Brass
25-0518-11H
Aries Electronics
Inquiry
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-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 518 - Through Hole Open Frame Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Gold 10μin (0.25μm) Brass
25-0513-11H
Aries Electronics
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 513 - Through Hole - Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Gold 10μin (0.25μm) Brass
25-0517-90C
Aries Electronics
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 517 - Through Hole,Right Angle - Solder Polyamide (PA46),Nylon 4/6,Glass Filled - Gold 30μin (0.76μm) Beryllium Copper - Tin 200μin (5.08μm) Brass
25-0508-20
Aries Electronics
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 508 -55°C ~ 105°C Through Hole - Wire Wrap Polyamide (PA46),Nylon 4/6 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper - Tin 200μin (5.08μm) Brass
25-0508-30
Aries Electronics
Inquiry
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MOQ: 1  MPQ: 1
CONN SOCKET SIP 25POS GOLD
Bulk 508 -55°C ~ 105°C Through Hole - Wire Wrap Polyamide (PA46),Nylon 4/6 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper - Tin 200μin (5.08μm) Brass