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Discover 10 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Mill-Max Manufacturing Corp. |
203
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 68POS GOLD
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117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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On Shore Technology Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 68POS
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ED | -55°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 0.050" (1.27mm) | - | - | Phosphor Bronze | 0.050" (1.27mm) | - | - | Phosphor Bronze | ||
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On Shore Technology Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 68POS TIN
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ED | -55°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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Mill-Max Manufacturing Corp. |
6
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 68POS GOLD
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117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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Preci-Dip |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 68POS GOLD
|
117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 0.070" (1.78mm) | Gold | Flash | Beryllium Copper | 0.070" (1.78mm) | Tin | - | Brass | |||
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Preci-Dip |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 68POS GOLD
|
117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 0.070" (1.78mm) | Gold | 29.5μin (0.75μm) | Beryllium Copper | 0.070" (1.78mm) | Tin | - | Brass | |||
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Preci-Dip |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 68POS GOLD
|
117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 0.070" (1.78mm) | Gold | Flash | Beryllium Copper | 0.070" (1.78mm) | Tin | - | Brass | |||
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Preci-Dip |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 68POS GOLD
|
117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 0.070" (1.78mm) | Gold | 29.5μin (0.75μm) | Beryllium Copper | 0.070" (1.78mm) | Tin | - | Brass | |||
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Mill-Max Manufacturing Corp. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 68POS GOLD
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127 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 68POS GOLD
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127 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy |
