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Discover 216 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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TE Connectivity AMP Connectors |
996
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 36POS GOLD
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Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyester | Gold | 25μin (0.63μm) | Copper Alloy | - | - | - | ||
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Mill-Max Manufacturing Corp. |
183
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 36POS GOLD
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Tube | 299 | -55°C ~ 125°C | Through Hole，Right Angle，Horizontal | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
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Bulk | 714 | -55°C ~ 125°C | Through Hole | DIP，0.1" (2.54mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 299 | -55°C ~ 125°C | Through Hole，Right Angle，Horizontal | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS TINLEAD
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Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Tin-Lead | 200μin (5.08μm) | Beryllium Copper | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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|
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Mill-Max Manufacturing Corp. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 10μin (0.25μm) | Beryllium Copper | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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|
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Mill-Max Manufacturing Corp. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 10μin (0.25μm) | Brass Alloy | ||
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Preci-Dip |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | Flash | Beryllium Copper | Tin | - | Brass | |||
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|
Preci-Dip |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 115 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | Flash | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | Flash | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 114 | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | Flash | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 115 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | Flash | Beryllium Copper | Tin | - | Brass | |||
|
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Preci-Dip |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Bulk | 612 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | Flash | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 116 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Elevated，Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | Flash | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 115 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | 29.5μin (0.75μm) | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 116 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Elevated，Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | Flash | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 114 | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | 29.5μin (0.75μm) | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 115 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | 29.5μin (0.75μm) | Beryllium Copper | Tin | - | Brass |
