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Discover 26 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Mill-Max Manufacturing Corp. |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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346 | -55°C ~ 125°C | Through Hole | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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346 | -55°C ~ 125°C | Through Hole | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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714 | -55°C ~ 125°C | Through Hole | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
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Harwin Inc. |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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D01-997 | -55°C ~ 125°C | Through Hole | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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518 | - | Surface Mount | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS TIN
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511 | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 50μin (1.27μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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508 | -55°C ~ 105°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6 | Gold | 10μin (0.25μm) | Beryllium Copper | - | Gold | 10μin (0.25μm) | Brass | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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508 | -55°C ~ 105°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6 | Gold | 10μin (0.25μm) | Beryllium Copper | - | Gold | 10μin (0.25μm) | Brass | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS TIN
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501 | -55°C ~ 105°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS TIN
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501 | -55°C ~ 105°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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501 | -55°C ~ 125°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS GOLD
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501 | -55°C ~ 125°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS TIN
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700 Elevator Strip-Line | -55°C ~ 105°C | Through Hole | Elevated | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS TIN
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700 Elevator Strip-Line | -55°C ~ 105°C | Through Hole | Elevated | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
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Aries Electronics |
Inquiry
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 31POS TIN
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700 Elevator Strip-Line | -55°C ~ 105°C | Through Hole | Elevated | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze |
