- Manufacturer：
-
- Operating Temperature：
-
- Mounting Type：
-
- Features：
-
- Termination：
-
- Housing Material：
-
- Contact Finish Thickness - Mating：
-
- Contact Material - Mating：
-
- Pitch - Post：
-
- Contact Finish - Post：
-
- Contact Finish Thickness - Post：
-
- Contact Material - Post：
-
- Selected conditions:
Discover 23 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|
|
|
Mill-Max Manufacturing Corp. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS GOLD
|
346 | -55°C ~ 125°C | Through Hole | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS GOLD
|
346 | -55°C ~ 125°C | Through Hole | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS GOLD
|
714 | -55°C ~ 125°C | Through Hole | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS GOLD
|
518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS GOLD
|
518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS GOLD
|
518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS GOLD
|
518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS GOLD
|
518 | - | Surface Mount | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS TIN
|
511 | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 50μin (1.27μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS GOLD
|
518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS GOLD
|
508 | -55°C ~ 105°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6 | Gold | 10μin (0.25μm) | Beryllium Copper | - | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS GOLD
|
508 | -55°C ~ 105°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6 | Gold | 10μin (0.25μm) | Beryllium Copper | - | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS TIN
|
700 Elevator Strip-Line | -55°C ~ 105°C | Through Hole | Elevated | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS TIN
|
700 Elevator Strip-Line | -55°C ~ 105°C | Through Hole | Elevated | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS TIN
|
700 Elevator Strip-Line | -55°C ~ 105°C | Through Hole | Elevated | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS TIN
|
700 Elevator Strip-Line | -55°C ~ 105°C | Through Hole | Elevated | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS TIN
|
501 | -55°C ~ 105°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS TIN
|
501 | -55°C ~ 105°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS GOLD
|
501 | -55°C ~ 125°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 35POS GOLD
|
501 | -55°C ~ 125°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze |
