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- Packaging：
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Discover 16,861 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Mill-Max Manufacturing Corp. |
1,065
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN TRANSIST TO-5 4POS GOLD
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Tube | 917 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 4 (Round) | Gold | 30μin (0.76μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Sullins Connector Solutions |
829
|
3 days |
-
|
MOQ: 1 MPQ: 1
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CONN SOCKET TRANSIST 3POS GOLD
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Bulk | - | -55°C ~ 175°C | Through Hole | Transistor | Board Guide | Solder | Polyphenylene Sulfide (PPS) | 3 (Rectangular) | Gold | 30μin (0.76μm) | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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3M |
683
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 8POS GOLD
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Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 8 (2 x 4) | Gold | 30μin (0.76μm) | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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3M |
337
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SOIC 16POS GOLD
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Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 16 (2 x 8) | Gold | - | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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Apex Microtechnology |
999
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN TRANSIST TO-3 8POS GOLD
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Bulk | Apex Precision Power | - | Through Hole | Transistor，TO-3 | Closed Frame | Solder | Polyester，Glass Filled | 8 (Oval) | Gold | 30μin (0.76μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass | ||
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Mill-Max Manufacturing Corp. |
2,068
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 3POS GOLD
|
Tube | 917 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 3 (Round) | Gold | 30μin (0.76μm) | Beryllium Copper | - | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
1,622
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 3POS GOLD
|
Tube | 917 | -55°C ~ 125°C | Surface Mount | Transistor，TO-5 | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 3 (Round) | Gold | 30μin (0.76μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
3,220
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 3POS GOLD
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Tube | 917 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 3 (Round) | Gold | 30μin (0.76μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
1,176
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 8POS GOLD
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Tube | 917 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (Round) | Gold | 30μin (0.76μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass Alloy | ||
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TE Connectivity AMP Connectors |
1,077
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 3POS GOLD
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Bulk | 8058 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polytetrafluoroethylene (PTFE) | 3 (Round) | Gold | - | Beryllium Copper | - | Gold | - | Brass | ||
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TE Connectivity AMP Connectors |
378
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 4POS GOLD
|
Bulk | 8058 | -55°C ~ 125°C | Panel Mount | Transistor，TO-5 | - | Solder Cup | Polytetrafluoroethylene (PTFE) | 4 (Round) | Gold | - | Beryllium Copper | - | Gold | - | Brass | ||
|
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|
Sullins Connector Solutions |
144
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET TRANSIST 3POS GOLD
|
Bulk | - | -55°C ~ 175°C | Through Hole | Transistor | Board Guide，Flange | Solder | Polyphenylene Sulfide (PPS) | 3 (Rectangular) | Gold | 30μin (0.76μm) | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
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Sullins Connector Solutions |
103
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-220/TO-247 5POS
|
Bulk | - | -65°C ~ 175°C | Through Hole | Transistor，TO-220 and TO-247 | - | Solder | Polyphenylene Sulfide (PPS) | 5 (Rectangular) | Gold | 30μin (0.76μm) | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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3M |
198
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 28POS GOLD
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Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 28 (2 x 14) | Gold | - | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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TE Connectivity AMP Connectors |
359
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 8POS GOLD
|
Bulk | 8058 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polytetrafluoroethylene (PTFE) | 8 (Round) | Gold | - | Beryllium Copper | - | Gold | - | Brass | ||
|
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TE Connectivity AMP Connectors |
287
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-3 4POS GOLD
|
Bulk | 8080 | -55°C ~ 125°C | Through Hole | Transistor，TO-3 | Closed Frame | Solder | Fluoropolymer (FP) | 4 (Round) | Gold | - | Beryllium Copper | - | Gold | - | Beryllium Copper | ||
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|
|
3M |
155
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 14POS GOLD
|
Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 14 (2 x 7) | Gold | - | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,353
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET TRANSIST TO-5 4POS
|
Tube | 917 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 4 (Round) | Gold | Flash | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
962
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-3 4POS GOLD
|
Bulk | 8080 | -55°C ~ 125°C | Through Hole | Transistor，TO-3 | Closed Frame | Solder | Fluoropolymer (FP) | 4 (Round) | Gold | - | Beryllium Copper | - | Tin-Lead | - | Beryllium Copper | ||
|
|
|
TE Connectivity AMP Connectors |
392
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-3 3POS TIN-LEAD
|
Bulk | 8080 | -55°C ~ 125°C | Chassis Mount | Transistor，TO-3 | Closed Frame | Solder | Fluoropolymer (FP) | 3 (Oval) | Tin-Lead | 200μin (5.08μm) | Beryllium Copper | - | Tin-Lead | 200μin (5.08μm) | Beryllium Copper |
