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Discover 13 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | |
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TE Connectivity AMP Connectors |
8,969
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
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Tube | Diplomate DL | -40°C ~ 105°C | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Thermoplastic，Glass Filled | 8 (2 x 4) | Tin | 60μin (1.52μm) | Phosphor Bronze | Tin | - | |||
|
|
TE Connectivity AMP Connectors |
13,944
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS TIN
|
Tube | Diplomate DL | -40°C ~ 105°C | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Thermoplastic，Glass Filled | 6 (2 x 3) | Tin | 60μin (1.52μm) | Phosphor Bronze | Tin | - | |||
|
|
TE Connectivity AMP Connectors |
16,964
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
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Tube | Diplomate DL | -40°C ~ 105°C | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Thermoplastic，Glass Filled | 14 (2 x 7) | Tin | 60μin (1.52μm) | Phosphor Bronze | Tin | - | |||
|
|
TE Connectivity AMP Connectors |
5,425
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | Diplomate DL | -40°C ~ 105°C | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Thermoplastic，Glass Filled | 16 (2 x 8) | Tin | 60μin (1.52μm) | Phosphor Bronze | Tin | - | |||
|
|
TE Connectivity AMP Connectors |
7,071
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
Tube | Diplomate DL | -40°C ~ 105°C | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Thermoplastic，Glass Filled | 18 (2 x 9) | Tin | 60μin (1.52μm) | Phosphor Bronze | Tin | - | |||
|
|
TE Connectivity AMP Connectors |
3,728
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TIN
|
Tube | Diplomate DL | -40°C ~ 105°C | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Thermoplastic，Glass Filled | 20 (2 x 10) | Tin | 60μin (1.52μm) | Phosphor Bronze | Tin | - | |||
|
|
TE Connectivity AMP Connectors |
4,886
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS TIN
|
Tube | Diplomate DL | -40°C ~ 105°C | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Thermoplastic，Glass Filled | 24 (2 x 12) | Tin | 60μin (1.52μm) | Phosphor Bronze | Tin | - | |||
|
|
TE Connectivity AMP Connectors |
3,127
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
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Tube | Diplomate DL | -40°C ~ 105°C | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Thermoplastic，Glass Filled | 28 (2 x 14) | Tin | 60μin (1.52μm) | Phosphor Bronze | Tin | - | |||
|
|
TE Connectivity AMP Connectors |
8,563
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS TINLEAD
|
Tube | Diplomate DL | -55°C ~ 125°C | DIP，0.6" (15.24mm) Row Spacing | Open Frame，No Center Bar | Polyester | 32 (2 x 16) | Tin-Lead | 60μin (1.52μm) | Phosphor Bronze | Tin-Lead | 60μin (1.52μm) | |||
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TE Connectivity AMP Connectors |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
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Bulk | 500 | -55°C ~ 125°C | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Polyester | 28 (2 x 14) | Gold | 5μin (0.127μm) | Beryllium Copper | Tin-Lead | 5μin (0.13μm) | |||
|
|
TE Connectivity AMP Connectors |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TINLEAD
|
Bulk | 500 | -55°C ~ 105°C | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Polyester | 14 (2 x 7) | Tin-Lead | - | Beryllium Copper | Tin-Lead | - | |||
|
|
TE Connectivity AMP Connectors |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS TINLEAD
|
Bulk | 500 | -55°C ~ 105°C | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Polyester | 24 (2 x 12) | Tin-Lead | - | Beryllium Copper | Tin-Lead | - | |||
|
|
TE Connectivity AMP Connectors |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 22POS GOLD
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Bulk | 500 | -55°C ~ 125°C | DIP，0.4" (10.16mm) Row Spacing | Closed Frame | Polyester | 22 (2 x 11) | Gold | 25μin (0.63μm) | Beryllium Copper | Tin-Lead | 25μin (0.63μm) |
