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Discover 98 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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CnC Tech |
15,341
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS TIN
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-40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
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CnC Tech |
8,646
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS TIN
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-40°C ~ 105°C | Through Hole，Kinked Pin | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
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CnC Tech |
6,405
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 16POS TIN
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-40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
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CnC Tech |
21,928
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 20POS TIN
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-40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 20 (2 x 10) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
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CnC Tech |
12,656
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 6POS GOLD
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-40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 6 (2 x 3) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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CnC Tech |
2,414
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 28POS TIN
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-40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Phosphor Bronze | ||
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CnC Tech |
7,305
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS GOLD
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-40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 8 (2 x 4) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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CnC Tech |
5,739
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 44POS TIN
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-55°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | ||
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CnC Tech |
2,840
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 16POS GOLD
|
-40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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CnC Tech |
7,582
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 18POS GOLD
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-40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 18 (2 x 9) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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CnC Tech |
3,148
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 14POS TIN
|
-40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
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CnC Tech |
4,691
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 18POS TIN
|
-40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
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CnC Tech |
6,538
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 6POS TIN
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-40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 6 (2 x 3) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
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CnC Tech |
8,189
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 16POS TIN
|
-40°C ~ 105°C | Through Hole，Kinked Pin | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
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CnC Tech |
1,869
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
-40°C ~ 105°C | Through Hole，Kinked Pin | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
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CnC Tech |
2,878
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 32POS TIN
|
-55°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 32 (4 x 8) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | ||
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CnC Tech |
1,054
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
-40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 20 (2 x 10) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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CnC Tech |
1,061
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
-40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 28 (2 x 14) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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CnC Tech |
362
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 40POS TIN
|
-40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Phosphor Bronze | ||
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CnC Tech |
193
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
-40°C ~ 105°C | Through Hole，Kinked Pin | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze |
