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- Operating Temperature：
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Discover 248 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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ASSMANN WSW Components |
108,884
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3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS TIN
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Tube | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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ASSMANN WSW Components |
81,814
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 14POS TIN
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Tube | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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ASSMANN WSW Components |
48,059
|
3 days |
-
|
MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 16POS TIN
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Tube | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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ASSMANN WSW Components |
36,980
|
3 days |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 18POS TIN
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Tube | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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ASSMANN WSW Components |
45,190
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TIN
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Tube | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 20 (2 x 10) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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ASSMANN WSW Components |
47,594
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
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Tube | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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ASSMANN WSW Components |
24,224
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC SOCKET PLCC 44POS TIN SMD
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Tube | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polyamide (PA9T)，Nylon 9T，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||
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ASSMANN WSW Components |
8,465
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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ASSMANN WSW Components |
16,495
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
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Tube | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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ASSMANN WSW Components |
21,261
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
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Tube | -40°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT) | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||
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ASSMANN WSW Components |
11,029
|
3 days |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 68POS TIN
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Tube | -40°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT) | 68 (4 x 17) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||
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ASSMANN WSW Components |
7,338
|
3 days |
-
|
MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 28POS TIN
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Tube | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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ASSMANN WSW Components |
8,981
|
3 days |
-
|
MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 40POS TIN
|
Tube | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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ASSMANN WSW Components |
31,632
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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|
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ASSMANN WSW Components |
10,803
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS TIN
|
Tube | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 6 (2 x 3) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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ASSMANN WSW Components |
4,877
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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|
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ASSMANN WSW Components |
16,375
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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|
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ASSMANN WSW Components |
2,240
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
Tube | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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|
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ASSMANN WSW Components |
5,841
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS TIN
|
Tube | -55°C ~ 85°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 24 (2 x 12) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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|
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ASSMANN WSW Components |
10,713
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | -55°C ~ 85°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze |
