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- Current - Supply (Max)：
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Discover 92 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Function | Operating Temperature | Package / Case | Output | Size / Dimension | Frequency Stability | Current - Supply (Max) | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Function | Operating Temperature | Package / Case | Output | Size / Dimension | Frequency Stability | Current - Supply (Max) | |
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Microchip Technology |
67
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3 days |
-
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MOQ: 1 MPQ: 1
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OSC MEMS CONFIGURABLE OUTPUT
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DSC400 | Enable/Disable | -40°C ~ 85°C | 20-VFQFN Exposed Pad | HCSL | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±50ppm | - | |||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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OSC MEMS CONFIGURALBE OUTPUT
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DSC2130 | - | -40°C ~ 85°C | 14-SMD，No Lead | LVDS | 0.126" L x 0.098" W (3.20mm x 2.50mm) | ±25ppm | 32mA | |||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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OSC MEMS CONFIGURABLE OUTPUT
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DSC2011 | Enable/Disable | -40°C ~ 85°C | 14-SMD，No Lead | CMOS | 0.126" L x 0.098" W (3.20mm x 2.50mm) | ±50ppm | 32mA (Typ) | ||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
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DSC2130 | Enable/Disable | -20°C ~ 70°C | 14-SMD，No Lead | LVDS | 0.126" L x 0.098" W (3.20mm x 2.50mm) | ±50ppm | 32mA | |||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC2130 | Enable/Disable | -20°C ~ 70°C | 14-SMD，No Lead | LVDS | 0.126" L x 0.098" W (3.20mm x 2.50mm) | ±50ppm | 32mA | |||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC2311 | Enable/Disable | -40°C ~ 105°C | 6-SMD，No Lead | CMOS | 0.098" L x 0.079" W (2.50mm x 2.00mm) | ±50ppm | - | ||
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC2311 | Enable/Disable | -40°C ~ 105°C | 6-SMD，No Lead | CMOS | 0.098" L x 0.079" W (2.50mm x 2.00mm) | ±25ppm | - | ||
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|
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Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC2311 | Enable/Disable | -40°C ~ 105°C | 6-SMD，No Lead | CMOS | 0.098" L x 0.079" W (2.50mm x 2.00mm) | ±25ppm | - | ||
|
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Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC400 | Enable/Disable | -20°C ~ 70°C | 20-VFQFN Exposed Pad | LVCMOS | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±25ppm | - | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC400 | Enable/Disable | -40°C ~ 85°C | 20-VFQFN Exposed Pad | LVCMOS，LVDS | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±25ppm | - | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC400 | Enable/Disable | -20°C ~ 70°C | 20-VFQFN Exposed Pad | LVDS | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±50ppm | - | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC400 | Enable/Disable | -40°C ~ 85°C | 20-VFQFN Exposed Pad | LVDS | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±25ppm | - | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC400 | Enable/Disable | -20°C ~ 70°C | 20-VFQFN Exposed Pad | HCSL | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±50ppm | - | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC400 | Enable/Disable | -20°C ~ 70°C | 20-VFQFN Exposed Pad | HCSL，LVCMOS | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±50ppm | - | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC400 | Enable/Disable | -20°C ~ 70°C | 20-VFQFN Exposed Pad | LVCMOS | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±50ppm | - | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC400 | Enable/Disable | -20°C ~ 70°C | 20-VFQFN Exposed Pad | LVCMOS | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±50ppm | - | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC400 | Enable/Disable | -40°C ~ 85°C | 20-VFQFN Exposed Pad | LVCMOS | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±50ppm | - | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC400 | Enable/Disable | -40°C ~ 85°C | 20-VFQFN Exposed Pad | LVCMOS | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±25ppm | - | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC400 | Enable/Disable | -40°C ~ 85°C | 20-VFQFN Exposed Pad | LVCMOS | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±25ppm | - | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS CONFIGURABLE OUTPUT
|
DSC400 | Enable/Disable | -20°C ~ 70°C | 20-VFQFN Exposed Pad | LVCMOS，LVPECL | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±50ppm | - |
