Discover 2,512 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Series Function Voltage - Supply Operating Temperature Package / Case Output Type Size / Dimension Height Frequency Stability Current - Supply (Max) Programmable Type Available Frequency Range Frequency Stability (Total)
DSC8001DI5
Microchip Technology
375
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 2.5X2.0 CMOS
Tube DSC8001 Standby 1.8 V ~ 3.3 V -40°C ~ 85°C 4-SMD,No Lead CMOS MEMS (Silicon) 0.098" L x 0.079" W (2.50mm x 2.00mm) 0.035" (0.90mm) - 12.2mA Blank (User Must Program) 1MHz ~ 150MHz ±10ppm
DSC8123DI2
Microchip Technology
230
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 2.5X2.0 LVDS
Tube DSC8123 Enable/Disable 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead LVDS MEMS (Silicon) 0.098" L x 0.079" W (2.50mm x 2.00mm) 0.035" (0.90mm) - 32mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8123BI2
Microchip Technology
101
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 5.0X3.2 LVDS
Tube DSC8123 Enable/Disable 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead LVDS MEMS (Silicon) 0.197" L x 0.126" W (5.00mm x 3.20mm) 0.035" (0.90mm) - 32mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8103CI2
Microchip Technology
106
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 3.2X2.5 LVDS
Tube DSC8103 Standby 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead LVDS MEMS (Silicon) 0.126" L x 0.098" W (3.20mm x 2.50mm) 0.035" (0.90mm) - 32mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8001CI5
Microchip Technology
400
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 3.2X2.5 CMOS
Tube DSC8001 Standby 1.8 V ~ 3.3 V -40°C ~ 85°C 4-SMD,No Lead CMOS MEMS (Silicon) 0.126" L x 0.098" W (3.20mm x 2.50mm) 0.035" (0.90mm) - 12.2mA Blank (User Must Program) 1MHz ~ 150MHz ±10ppm
DSC8101DI5
Microchip Technology
420
3 days
-
MOQ: 1  MPQ: 1
OSC PGM 10MHZ - 100MHZ SMD
Tube DSC8101 Standby 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead CMOS MEMS (Silicon) 0.098" L x 0.079" W (2.50mm x 2.00mm) 0.035" (0.90mm) ±10ppm 35mA Blank (User Must Program) 10MHz ~ 100MHz -
DSC8001BI5
Microchip Technology
108
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 5.0X3.2 CMOS
Tube DSC8001 Standby 1.8 V ~ 3.3 V -40°C ~ 85°C 4-SMD,No Lead CMOS MEMS (Silicon) 0.197" L x 0.126" W (5.00mm x 3.20mm) 0.035" (0.90mm) - 12.2mA Blank (User Must Program) 1MHz ~ 150MHz ±10ppm
DSC8124DI2
Microchip Technology
414
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 2.5X2.0 HCSL
Tube DSC8124 Enable/Disable 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead HCSL XO (Standard) 0.098" L x 0.079" W (2.50mm x 2.00mm) 0.035" (0.90mm) - 42mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8104BI2
Microchip Technology
430
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 5.0X3.2 HCSL
Tube DSC8104 Standby 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead HCSL MEMS (Silicon) 0.197" L x 0.126" W (5.00mm x 3.20mm) 0.035" (0.90mm) - 42mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8101AL2
Microchip Technology
400
3 days
-
MOQ: 1  MPQ: 1
OSC PGM 10MHZ - 170MHZ SMD
Tube DSC8101 Standby 2.25 V ~ 3.6 V -40°C ~ 105°C 6-SMD,No Lead Exposed Pad CMOS MEMS (Silicon) 0.276" L x 0.197" W (7.00mm x 5.00mm) 0.035" (0.90mm) ±25ppm 35mA Blank (User Must Program) 10MHz ~ 170MHz -
DSC8104CI2
Microchip Technology
440
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 3.2X2.5 HCSL
Tube DSC8104 Standby 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead HCSL MEMS (Silicon) 0.126" L x 0.098" W (3.20mm x 2.50mm) 0.035" (0.90mm) - 42mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8124BI2
Microchip Technology
432
3 days
-
MOQ: 1  MPQ: 1
OSC PROGRAMMABLE HCSL
Tube DSC8124 Enable/Disable 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead HCSL MEMS (Silicon) 0.197" L x 0.126" W (5.00mm x 3.20mm) 0.035" (0.90mm) ±25ppm 42mA Blank (User Must Program) 10MHz ~ 460MHz -
DSC8124AI2
Microchip Technology
400
3 days
-
MOQ: 1  MPQ: 1
OSC PGM 10MHZ - 460MHZ SMD
Tube DSC8124 Enable/Disable 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead Exposed Pad HCSL MEMS (Silicon) 0.276" L x 0.197" W (7.00mm x 5.00mm) 0.035" (0.90mm) ±25ppm 42mA Blank (User Must Program) 10MHz ~ 460MHz -
DSC8104CI5
Microchip Technology
440
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 3.2X2.5 HCSL
Tube DSC8104 Standby 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead HCSL MEMS (Silicon) 0.126" L x 0.098" W (3.20mm x 2.50mm) 0.035" (0.90mm) - 42mA Blank (User Must Program) 10MHz ~ 460MHz ±10ppm
DSC8103DI2
Microchip Technology
245
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK
Tube DSC8103 Standby 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead LVDS MEMS (Silicon) 0.098" L x 0.079" W (2.50mm x 2.00mm) 0.035" (0.90mm) ±25ppm 32mA Blank (User Must Program) 10MHz ~ 460MHz -
DSC8122DI2
Microchip Technology
280
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 2.5X2.0 LVPECL
Tube DSC8122 Enable/Disable 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead LVPECL MEMS (Silicon) 0.098" L x 0.079" W (2.50mm x 2.00mm) 0.035" (0.90mm) - 58mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8102BI2
Microchip Technology
216
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 5.0X3.2 CMOS
Tube DSC8102 Standby 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead LVPECL MEMS (Silicon) 0.197" L x 0.126" W (5.00mm x 3.20mm) 0.035" (0.90mm) - 58mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8102AI2
Microchip Technology
200
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 7.0X5.0 CMOS
Tube DSC8102 Standby 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead LVPECL MEMS (Silicon) 0.276" L x 0.197" W (7.00mm x 5.00mm) 0.035" (0.90mm) - 58mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8103AI2
Microchip Technology
197
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 7.0X5.0 LVDS
Tube DSC8103 Standby 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead LVDS MEMS (Silicon) 0.276" L x 0.197" W (7.00mm x 5.00mm) 0.035" (0.90mm) - 32mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8123AI2
Microchip Technology
180
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 7.0X5.0 LVDS
Tube DSC8123 Enable/Disable 2.25 V ~ 3.6 V -40°C ~ 85°C 6-SMD,No Lead LVDS MEMS (Silicon) 0.276" L x 0.197" W (7.00mm x 5.00mm) 0.035" (0.90mm) - 32mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm