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Discover 55 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Output | Type | Size / Dimension | Ratings | Frequency Stability | Current - Supply (Max) | Programmable Type | Frequency Stability (Total) | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Output | Type | Size / Dimension | Ratings | Frequency Stability | Current - Supply (Max) | Programmable Type | Frequency Stability (Total) | |
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Microchip Technology |
875
|
3 days |
-
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MOQ: 1 MPQ: 1
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MEMS OSC UNPROGRAM 25PPM 6VDFN
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Tube | DSC8124 | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | ±25ppm | 42mA | Blank (User Must Program) | - | ||
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Microchip Technology |
845
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 10PPM 6VDFN
|
Tube | DSC8124 | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | ±10ppm | 42mA | Blank (User Must Program) | - | ||
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Microchip Technology |
230
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 2.5X2.0 LVDS
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Tube | DSC8123 | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | - | 32mA | Blank (User Must Program) | ±25ppm | ||
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Microchip Technology |
101
|
3 days |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 LVDS
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Tube | DSC8123 | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | AEC-Q100 | - | 32mA | Blank (User Must Program) | ±25ppm | ||
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Microchip Technology |
660
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 10PPM 6VDFN
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Tube | DSC8123 | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | ±10ppm | 32mA | Blank (User Must Program) | - | ||
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Microchip Technology |
414
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 2.5X2.0 HCSL
|
Tube | DSC8124 | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | XO (Standard) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | - | 42mA | Blank (User Must Program) | ±25ppm | ||
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Microchip Technology |
432
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC PROGRAMMABLE HCSL
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Tube | DSC8124 | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | AEC-Q100 | ±25ppm | 42mA | Blank (User Must Program) | - | ||
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Microchip Technology |
400
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC PGM 10MHZ - 460MHZ SMD
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Tube | DSC8124 | -40°C ~ 85°C | 6-SMD，No Lead Exposed Pad | HCSL | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | AEC-Q100 | ±25ppm | 42mA | Blank (User Must Program) | - | ||
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 10PPM 6VDFN
|
Tape & Reel (TR) | DSC8123 | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | ±10ppm | 32mA | Blank (User Must Program) | - | ||
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Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 10PPM 6VDFN
|
Cut Tape (CT) | DSC8123 | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | ±10ppm | 32mA | Blank (User Must Program) | - | ||
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Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 10PPM 6VDFN
|
- | DSC8123 | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | ±10ppm | 32mA | Blank (User Must Program) | - | ||
|
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Microchip Technology |
280
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 2.5X2.0 LVPECL
|
Tube | DSC8122 | -40°C ~ 85°C | 6-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | - | 58mA | Blank (User Must Program) | ±25ppm | ||
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|
|
Microchip Technology |
180
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 LVDS
|
Tube | DSC8123 | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | AEC-Q100 | - | 32mA | Blank (User Must Program) | ±25ppm | ||
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|
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Microchip Technology |
220
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 LVPECL
|
Tube | DSC8122 | -40°C ~ 85°C | 6-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | - | 58mA | Blank (User Must Program) | ±25ppm | ||
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|
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Microchip Technology |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 LVDS
|
Tube | DSC8123 | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | - | 32mA | Blank (User Must Program) | ±25ppm | ||
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|
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Microchip Technology |
191
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC PGM 10MHZ - 460MHZ SMD
|
Tube | DSC8122 | -40°C ~ 85°C | 6-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | AEC-Q100 | ±10ppm | 58mA | Blank (User Must Program) | - | ||
|
|
|
Microchip Technology |
120
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK CMOS
|
Tube | DSC8123 | -40°C ~ 85°C | 6-SMD，No Lead Exposed Pad | LVDS | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | AEC-Q100 | ±10ppm | 32mA | Blank (User Must Program) | - | ||
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
OSC PROG LVPECL 2.25 V - 3.6 V
|
Tape & Reel (TR) | DSC8122 | -40°C ~ 85°C | 4-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | - | 58mA | Blank (User Must Program) | ±10ppm | ||
|
|
|
Microchip Technology |
995
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC PROG LVPECL 2.25 V - 3.6 V
|
Cut Tape (CT) | DSC8122 | -40°C ~ 85°C | 4-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | - | 58mA | Blank (User Must Program) | ±10ppm | ||
|
|
|
Microchip Technology |
995
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC PROG LVPECL 2.25 V - 3.6 V
|
- | DSC8122 | -40°C ~ 85°C | 4-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | - | 58mA | Blank (User Must Program) | ±10ppm |
