- Manufacturer：
-
- Packaging：
-
- Series：
-
- Voltage - Supply：
-
- Operating Temperature：
-
- Size / Dimension：
-
- Ratings：
-
- Height：
-
- Frequency Stability：
-
- Current - Supply (Max)：
-
- Programmable Type：
-
- Available Frequency Range：
-
- Frequency Stability (Total)：
-
- Selected conditions:
Discover 1,266 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Output | Type | Size / Dimension | Ratings | Height | Frequency Stability | Current - Supply (Max) | Programmable Type | Available Frequency Range | Frequency Stability (Total) | Spread Spectrum Bandwidth | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Output | Type | Size / Dimension | Ratings | Height | Frequency Stability | Current - Supply (Max) | Programmable Type | Available Frequency Range | Frequency Stability (Total) | Spread Spectrum Bandwidth | |
|
|
|
Microchip Technology |
253
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | DSC8101 | 2.25 V ~ 3.6 V | -40°C ~ 105°C | CMOS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | 0.035" (0.90mm) | - | 35mA | Blank (User Must Program) | 10MHz ~ 170MHz | ±10ppm | - | ||
|
|
|
Microchip Technology |
840
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 25PPM 6VDFN
|
Tube | DSC8102 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | LVPECL | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | 0.035" (0.90mm) | ±25ppm | 58mA | Blank (User Must Program) | 10MHz ~ 460MHz | - | - | ||
|
|
|
Microchip Technology |
106
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 LVDS
|
Tube | DSC8103 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | LVDS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | 0.035" (0.90mm) | - | 32mA | Blank (User Must Program) | 10MHz ~ 460MHz | ±25ppm | - | ||
|
|
|
Microchip Technology |
655
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | DSC8101 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | CMOS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | 0.035" (0.90mm) | - | 35mA | Blank (User Must Program) | 10MHz ~ 170MHz | ±25ppm | - | ||
|
|
|
Microchip Technology |
504
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 CMOS
|
Tube | DSC8101 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | CMOS | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | - | 0.035" (0.90mm) | - | 35mA | Blank (User Must Program) | 10MHz ~ 170MHz | ±25ppm | - | ||
|
|
|
Microchip Technology |
420
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC PGM 10MHZ - 100MHZ SMD
|
Tube | DSC8101 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | CMOS | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | 0.035" (0.90mm) | ±10ppm | 35mA | Blank (User Must Program) | 10MHz ~ 100MHz | - | - | ||
|
|
|
Microchip Technology |
502
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 CMOS
|
Tube | DSC8101 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | CMOS | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | - | 0.035" (0.90mm) | - | 35mA | Blank (User Must Program) | 10MHz ~ 170MHz | ±10ppm | - | ||
|
|
|
Microchip Technology |
440
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | DSC8101 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | CMOS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | 0.035" (0.90mm) | - | 35mA | Blank (User Must Program) | 10MHz ~ 170MHz | ±10ppm | - | ||
|
|
|
Microchip Technology |
430
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 HCSL
|
Tube | DSC8104 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | HCSL | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | AEC-Q100 | 0.035" (0.90mm) | - | 42mA | Blank (User Must Program) | 10MHz ~ 460MHz | ±25ppm | - | ||
|
|
|
Microchip Technology |
440
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 HCSL
|
Tube | DSC8104 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | HCSL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | 0.035" (0.90mm) | - | 42mA | Blank (User Must Program) | 10MHz ~ 460MHz | ±25ppm | - | ||
|
|
|
Microchip Technology |
440
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 HCSL
|
Tube | DSC8104 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | HCSL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | 0.035" (0.90mm) | - | 42mA | Blank (User Must Program) | 10MHz ~ 460MHz | ±10ppm | - | ||
|
|
|
Microchip Technology |
320
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | DSC8101 | 2.25 V ~ 3.6 V | -55°C ~ 125°C | CMOS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | 0.035" (0.90mm) | - | 35mA | Blank (User Must Program) | 10MHz ~ 170MHz | ±25ppm | - | ||
|
|
|
Microchip Technology |
245
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK
|
Tube | DSC8103 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | LVDS | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | 0.035" (0.90mm) | ±25ppm | 32mA | Blank (User Must Program) | 10MHz ~ 460MHz | - | - | ||
|
|
|
Microchip Technology |
216
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 CMOS
|
Tube | DSC8102 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | LVPECL | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | AEC-Q100 | 0.035" (0.90mm) | - | 58mA | Blank (User Must Program) | 10MHz ~ 460MHz | ±25ppm | - | ||
|
|
|
Microchip Technology |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 CMOS
|
Tube | DSC8102 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | LVPECL | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | AEC-Q100 | 0.035" (0.90mm) | - | 58mA | Blank (User Must Program) | 10MHz ~ 460MHz | ±25ppm | - | ||
|
|
|
Microchip Technology |
197
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 LVDS
|
Tube | DSC8103 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | LVDS | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | AEC-Q100 | 0.035" (0.90mm) | - | 32mA | Blank (User Must Program) | 10MHz ~ 460MHz | ±25ppm | - | ||
|
|
|
Microchip Technology |
220
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | DSC8102 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | LVPECL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | 0.035" (0.90mm) | - | 58mA | Blank (User Must Program) | 10MHz ~ 460MHz | ±25ppm | - | ||
|
|
|
Microchip Technology |
140
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 2.5X2.0 CMOS
|
Tube | DSC8102 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | LVPECL | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | 0.035" (0.90mm) | - | 58mA | Blank (User Must Program) | 10MHz ~ 460MHz | ±10ppm | - | ||
|
|
|
Microchip Technology |
220
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | DSC8102 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | LVPECL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | 0.035" (0.90mm) | - | 58mA | Blank (User Must Program) | 10MHz ~ 460MHz | ±10ppm | - | ||
|
|
|
Microchip Technology |
210
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 LVDS
|
Tube | DSC8103 | 2.25 V ~ 3.6 V | -40°C ~ 85°C | LVDS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | 0.035" (0.90mm) | - | 32mA | Blank (User Must Program) | 10MHz ~ 460MHz | ±10ppm | - |
