Discover 216 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Series Function Operating Temperature Package / Case Output Type Size / Dimension Ratings Height Frequency Stability Current - Supply (Max) Programmable Type Available Frequency Range Frequency Stability (Total)
DSC8104CI2
Microchip Technology
440
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 3.2X2.5 HCSL
Tube DSC8104 Standby -40°C ~ 85°C 6-SMD,No Lead HCSL MEMS (Silicon) 0.126" L x 0.098" W (3.20mm x 2.50mm) AEC-Q100 0.035" (0.90mm) - 42mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8124BI2
Microchip Technology
432
3 days
-
MOQ: 1  MPQ: 1
OSC PROGRAMMABLE HCSL
Tube DSC8124 Enable/Disable -40°C ~ 85°C 6-SMD,No Lead HCSL MEMS (Silicon) 0.197" L x 0.126" W (5.00mm x 3.20mm) AEC-Q100 0.035" (0.90mm) ±25ppm 42mA Blank (User Must Program) 10MHz ~ 460MHz -
DSC8124AI2
Microchip Technology
400
3 days
-
MOQ: 1  MPQ: 1
OSC PGM 10MHZ - 460MHZ SMD
Tube DSC8124 Enable/Disable -40°C ~ 85°C 6-SMD,No Lead Exposed Pad HCSL MEMS (Silicon) 0.276" L x 0.197" W (7.00mm x 5.00mm) AEC-Q100 0.035" (0.90mm) ±25ppm 42mA Blank (User Must Program) 10MHz ~ 460MHz -
DSC8104CI5
Microchip Technology
440
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 3.2X2.5 HCSL
Tube DSC8104 Standby -40°C ~ 85°C 6-SMD,No Lead HCSL MEMS (Silicon) 0.126" L x 0.098" W (3.20mm x 2.50mm) AEC-Q100 0.035" (0.90mm) - 42mA Blank (User Must Program) 10MHz ~ 460MHz ±10ppm
DSC8101CM2
Microchip Technology
320
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 3.2X2.5 CMOS
Tube DSC8101 Standby -55°C ~ 125°C 6-SMD,No Lead CMOS MEMS (Silicon) 0.126" L x 0.098" W (3.20mm x 2.50mm) - 0.035" (0.90mm) - 35mA Blank (User Must Program) 10MHz ~ 170MHz ±25ppm
DSC8103DI2
Microchip Technology
245
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK
Tube DSC8103 Standby -40°C ~ 85°C 6-SMD,No Lead LVDS MEMS (Silicon) 0.098" L x 0.079" W (2.50mm x 2.00mm) AEC-Q100 0.035" (0.90mm) ±25ppm 32mA Blank (User Must Program) 10MHz ~ 460MHz -
DSC8123DI5T
Microchip Technology
1,000
3 days
-
MOQ: 1  MPQ: 1
MEMS OSC UNPROGRAM 10PPM 6VDFN
Tape & Reel (TR) DSC8123 Enable/Disable -40°C ~ 85°C 6-SMD,No Lead LVDS MEMS (Silicon) 0.098" L x 0.079" W (2.50mm x 2.00mm) - 0.035" (0.90mm) ±10ppm 32mA Blank (User Must Program) 10MHz ~ 460MHz -
DSC8123DI5T
Microchip Technology
1,000
3 days
-
MOQ: 1  MPQ: 1
MEMS OSC UNPROGRAM 10PPM 6VDFN
Cut Tape (CT) DSC8123 Enable/Disable -40°C ~ 85°C 6-SMD,No Lead LVDS MEMS (Silicon) 0.098" L x 0.079" W (2.50mm x 2.00mm) - 0.035" (0.90mm) ±10ppm 32mA Blank (User Must Program) 10MHz ~ 460MHz -
DSC8123DI5T
Microchip Technology
1,000
3 days
-
MOQ: 1  MPQ: 1
MEMS OSC UNPROGRAM 10PPM 6VDFN
- DSC8123 Enable/Disable -40°C ~ 85°C 6-SMD,No Lead LVDS MEMS (Silicon) 0.098" L x 0.079" W (2.50mm x 2.00mm) - 0.035" (0.90mm) ±10ppm 32mA Blank (User Must Program) 10MHz ~ 460MHz -
DSC8122DI2
Microchip Technology
280
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 2.5X2.0 LVPECL
Tube DSC8122 Enable/Disable -40°C ~ 85°C 6-SMD,No Lead LVPECL MEMS (Silicon) 0.098" L x 0.079" W (2.50mm x 2.00mm) AEC-Q100 0.035" (0.90mm) - 58mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8102BI2
Microchip Technology
216
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 5.0X3.2 CMOS
Tube DSC8102 Standby -40°C ~ 85°C 6-SMD,No Lead LVPECL MEMS (Silicon) 0.197" L x 0.126" W (5.00mm x 3.20mm) AEC-Q100 0.035" (0.90mm) - 58mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8102AI2
Microchip Technology
200
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 7.0X5.0 CMOS
Tube DSC8102 Standby -40°C ~ 85°C 6-SMD,No Lead LVPECL MEMS (Silicon) 0.276" L x 0.197" W (7.00mm x 5.00mm) AEC-Q100 0.035" (0.90mm) - 58mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8103AI2
Microchip Technology
197
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 7.0X5.0 LVDS
Tube DSC8103 Standby -40°C ~ 85°C 6-SMD,No Lead LVDS MEMS (Silicon) 0.276" L x 0.197" W (7.00mm x 5.00mm) AEC-Q100 0.035" (0.90mm) - 32mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8123AI2
Microchip Technology
180
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 7.0X5.0 LVDS
Tube DSC8123 Enable/Disable -40°C ~ 85°C 6-SMD,No Lead LVDS MEMS (Silicon) 0.276" L x 0.197" W (7.00mm x 5.00mm) AEC-Q100 0.035" (0.90mm) - 32mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8102CI2
Microchip Technology
220
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 3.2X2.5 CMOS
Tube DSC8102 Standby -40°C ~ 85°C 6-SMD,No Lead LVPECL MEMS (Silicon) 0.126" L x 0.098" W (3.20mm x 2.50mm) AEC-Q100 0.035" (0.90mm) - 58mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8122CI2
Microchip Technology
220
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 3.2X2.5 LVPECL
Tube DSC8122 Enable/Disable -40°C ~ 85°C 6-SMD,No Lead LVPECL MEMS (Silicon) 0.126" L x 0.098" W (3.20mm x 2.50mm) AEC-Q100 0.035" (0.90mm) - 58mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8123CI2
Microchip Technology
200
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 3.2X2.5 LVDS
Tube DSC8123 Enable/Disable -40°C ~ 85°C 6-SMD,No Lead LVDS MEMS (Silicon) 0.126" L x 0.098" W (3.20mm x 2.50mm) AEC-Q100 0.035" (0.90mm) - 32mA Blank (User Must Program) 10MHz ~ 460MHz ±25ppm
DSC8122BI5
Microchip Technology
191
3 days
-
MOQ: 1  MPQ: 1
OSC PGM 10MHZ - 460MHZ SMD
Tube DSC8122 Enable/Disable -40°C ~ 85°C 6-SMD,No Lead LVPECL MEMS (Silicon) 0.197" L x 0.126" W (5.00mm x 3.20mm) AEC-Q100 0.035" (0.90mm) ±10ppm 58mA Blank (User Must Program) 10MHz ~ 460MHz -
DSC8102DI5
Microchip Technology
140
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK 2.5X2.0 CMOS
Tube DSC8102 Standby -40°C ~ 85°C 6-SMD,No Lead LVPECL MEMS (Silicon) 0.098" L x 0.079" W (2.50mm x 2.00mm) AEC-Q100 0.035" (0.90mm) - 58mA Blank (User Must Program) 10MHz ~ 460MHz ±10ppm
DSC8123AI5
Microchip Technology
120
3 days
-
MOQ: 1  MPQ: 1
OSC MEMS BLANK CMOS
Tube DSC8123 Enable/Disable -40°C ~ 85°C 6-SMD,No Lead Exposed Pad LVDS MEMS (Silicon) 0.276" L x 0.197" W (7.00mm x 5.00mm) AEC-Q100 0.035" (0.90mm) ±10ppm 32mA Blank (User Must Program) 10MHz ~ 460MHz -