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Discover 102 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Function | Voltage - Supply | Operating Temperature | Package / Case | Output | Type | Size / Dimension | Ratings | Height | Current - Supply (Max) | Programmable Type | Available Frequency Range | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Function | Voltage - Supply | Operating Temperature | Package / Case | Output | Type | Size / Dimension | Ratings | Height | Current - Supply (Max) | Programmable Type | Available Frequency Range | |
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Microchip Technology |
230
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3 days |
-
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MOQ: 1 MPQ: 1
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OSC MEMS BLANK 2.5X2.0 LVDS
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DSC8123 | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | 0.035" (0.90mm) | 32mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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Microchip Technology |
101
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3 days |
-
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MOQ: 1 MPQ: 1
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OSC MEMS BLANK 5.0X3.2 LVDS
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DSC8123 | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | AEC-Q100 | 0.035" (0.90mm) | 32mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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Microchip Technology |
106
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3 days |
-
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MOQ: 1 MPQ: 1
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OSC MEMS BLANK 3.2X2.5 LVDS
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DSC8103 | Standby | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | 0.035" (0.90mm) | 32mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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Microchip Technology |
655
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3 days |
-
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MOQ: 1 MPQ: 1
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OSC MEMS BLANK 3.2X2.5 CMOS
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DSC8101 | Standby | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | CMOS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | 0.035" (0.90mm) | 35mA | Blank (User Must Program) | 10MHz ~ 170MHz | ||
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Microchip Technology |
549
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3 days |
-
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MOQ: 1 MPQ: 1
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OSC MEMS BLANK 7.0X5.0 CMOS
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DSC8121 | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | CMOS | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | - | 0.035" (0.90mm) | 35mA | Blank (User Must Program) | 10MHz ~ 170MHz | ||
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Microchip Technology |
504
|
3 days |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 CMOS
|
DSC8101 | Standby | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | CMOS | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | - | 0.035" (0.90mm) | 35mA | Blank (User Must Program) | 10MHz ~ 170MHz | ||
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Microchip Technology |
414
|
3 days |
-
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MOQ: 1 MPQ: 1
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OSC MEMS BLANK 2.5X2.0 HCSL
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DSC8124 | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | XO (Standard) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | 0.035" (0.90mm) | 42mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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Microchip Technology |
430
|
3 days |
-
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MOQ: 1 MPQ: 1
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OSC MEMS BLANK 5.0X3.2 HCSL
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DSC8104 | Standby | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | AEC-Q100 | 0.035" (0.90mm) | 42mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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Microchip Technology |
440
|
3 days |
-
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MOQ: 1 MPQ: 1
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OSC MEMS BLANK 3.2X2.5 HCSL
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DSC8104 | Standby | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | 0.035" (0.90mm) | 42mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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Microchip Technology |
320
|
3 days |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
DSC8101 | Standby | 2.25 V ~ 3.6 V | -55°C ~ 125°C | 6-SMD，No Lead | CMOS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | 0.035" (0.90mm) | 35mA | Blank (User Must Program) | 10MHz ~ 170MHz | ||
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Microchip Technology |
280
|
3 days |
-
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MOQ: 1 MPQ: 1
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OSC MEMS BLANK 2.5X2.0 LVPECL
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DSC8122 | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | 0.035" (0.90mm) | 58mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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Microchip Technology |
216
|
3 days |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 CMOS
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DSC8102 | Standby | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | AEC-Q100 | 0.035" (0.90mm) | 58mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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Microchip Technology |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 CMOS
|
DSC8102 | Standby | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | AEC-Q100 | 0.035" (0.90mm) | 58mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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Microchip Technology |
197
|
3 days |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 LVDS
|
DSC8103 | Standby | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | AEC-Q100 | 0.035" (0.90mm) | 32mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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Microchip Technology |
180
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 LVDS
|
DSC8123 | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | AEC-Q100 | 0.035" (0.90mm) | 32mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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Microchip Technology |
220
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
DSC8102 | Standby | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | 0.035" (0.90mm) | 58mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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|
|
Microchip Technology |
220
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 LVPECL
|
DSC8122 | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | 0.035" (0.90mm) | 58mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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|
|
Microchip Technology |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 LVDS
|
DSC8123 | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | 0.035" (0.90mm) | 32mA | Blank (User Must Program) | 10MHz ~ 460MHz | ||
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Microchip Technology |
304
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
DSC8002 | Standby | 1.8 V ~ 3.3 V | -40°C ~ 85°C | 4-SMD，No Lead | CMOS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | 0.035" (0.90mm) | 10mA | Blank (User Must Program) | 1MHz ~ 150MHz | ||
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Microchip Technology |
151
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 CMOS
|
DSC8001 | Standby | 1.8 V ~ 3.3 V | -40°C ~ 85°C | 4-SMD，No Lead | CMOS | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | AEC-Q100 | 0.035" (0.90mm) | 12.2mA | Blank (User Must Program) | 1MHz ~ 150MHz |
