Manufacturer:
Series:
Operating Temperature:
Package / Case:
Supplier Device Package:
Power - Max:
Drain to Source Voltage (Vdss):
Discover 73 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Series Operating Temperature Package / Case Supplier Device Package Mounting Type Power - Max FET Type Drain to Source Voltage (Vdss) Current - Continuous Drain (Id) @ 25°C Rds On (Max) @ Id,Vgs Vgs(th) (Max) @ Id Gate Charge (Qg) (Max) @ Vgs Input Capacitance (Ciss) (Max) @ Vds
EPC2103ENGRT
EPC
5,500
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN SYM HALF BRDG 80V
Tape & Reel (TR) eGaN - Die Die Surface Mount - 2 N-Channel (Half Bridge) 80V 23A 5.5 mOhm @ 20A,5V 2.5V @ 7mA 6.5nC @ 5V 7600pF @ 40V
EPC2103ENGRT
EPC
5,884
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN SYM HALF BRDG 80V
Cut Tape (CT) eGaN - Die Die Surface Mount - 2 N-Channel (Half Bridge) 80V 23A 5.5 mOhm @ 20A,5V 2.5V @ 7mA 6.5nC @ 5V 7600pF @ 40V
EPC2103ENGRT
EPC
5,884
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN SYM HALF BRDG 80V
- eGaN - Die Die Surface Mount - 2 N-Channel (Half Bridge) 80V 23A 5.5 mOhm @ 20A,5V 2.5V @ 7mA 6.5nC @ 5V 7600pF @ 40V
EPC2106ENGRT
EPC
20,000
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN 2N-CH 100V BUMPED DIE
Tape & Reel (TR) eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Half Bridge) 100V 1.7A 70 mOhm @ 2A,5V 2.5V @ 600μA 0.73nC @ 5V 75pF @ 50V
EPC2106ENGRT
EPC
22,285
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN 2N-CH 100V BUMPED DIE
Cut Tape (CT) eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Half Bridge) 100V 1.7A 70 mOhm @ 2A,5V 2.5V @ 600μA 0.73nC @ 5V 75pF @ 50V
EPC2106ENGRT
EPC
22,285
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN 2N-CH 100V BUMPED DIE
- eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Half Bridge) 100V 1.7A 70 mOhm @ 2A,5V 2.5V @ 600μA 0.73nC @ 5V 75pF @ 50V
EPC2100ENGRT
EPC
6,500
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2 N-CH 30V 9.5A/38A DIE
Tape & Reel (TR) eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Half Bridge) 30V 10A (Ta),40A (Ta) 8.2 mOhm @ 25A,5V,2.1 mOhm @ 25A,5V 2.5V @ 4mA,2.5V @ 16mA 4.9nC @ 15V,19nC @ 15V 475pF @ 15V,1960pF @ 15V
EPC2100ENGRT
EPC
6,546
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2 N-CH 30V 9.5A/38A DIE
Cut Tape (CT) eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Half Bridge) 30V 10A (Ta),40A (Ta) 8.2 mOhm @ 25A,5V,2.1 mOhm @ 25A,5V 2.5V @ 4mA,2.5V @ 16mA 4.9nC @ 15V,19nC @ 15V 475pF @ 15V,1960pF @ 15V
EPC2100ENGRT
EPC
6,546
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2 N-CH 30V 9.5A/38A DIE
- eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Half Bridge) 30V 10A (Ta),40A (Ta) 8.2 mOhm @ 25A,5V,2.1 mOhm @ 25A,5V 2.5V @ 4mA,2.5V @ 16mA 4.9nC @ 15V,19nC @ 15V 475pF @ 15V,1960pF @ 15V
EPC2102ENGRT
EPC
6,500
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2 N-CHANNEL 60V 23A DIE
Tape & Reel (TR) eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Half Bridge) 60V 23A (Tj) 4.4 mOhm @ 20A,5V 2.5V @ 7mA 6.8nC @ 5V 830pF @ 30V
EPC2102ENGRT
EPC
6,795
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2 N-CHANNEL 60V 23A DIE
Cut Tape (CT) eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Half Bridge) 60V 23A (Tj) 4.4 mOhm @ 20A,5V 2.5V @ 7mA 6.8nC @ 5V 830pF @ 30V
EPC2102ENGRT
EPC
6,795
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2 N-CHANNEL 60V 23A DIE
- eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Half Bridge) 60V 23A (Tj) 4.4 mOhm @ 20A,5V 2.5V @ 7mA 6.8nC @ 5V 830pF @ 30V
EPC2104ENGRT
EPC
2,000
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2NCH 100V 23A DIE
Tape & Reel (TR) eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Half Bridge) 100V 23A 6.3 mOhm @ 20A,5V 2.5V @ 5.5mA 7nC @ 5V 800pF @ 50V
EPC2104ENGRT
EPC
2,457
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2NCH 100V 23A DIE
Cut Tape (CT) eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Half Bridge) 100V 23A 6.3 mOhm @ 20A,5V 2.5V @ 5.5mA 7nC @ 5V 800pF @ 50V
EPC2104ENGRT
EPC
2,457
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2NCH 100V 23A DIE
- eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Half Bridge) 100V 23A 6.3 mOhm @ 20A,5V 2.5V @ 5.5mA 7nC @ 5V 800pF @ 50V
EPC2110ENGRT
EPC
25,000
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN 2N-CH 120V BUMPED DIE
Tape & Reel (TR) eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Dual) Common Source 120V 3.4A 60 mOhm @ 4A,5V 2.5V @ 700μA 0.8nC @ 5V 80pF @ 60V
EPC2110ENGRT
EPC
26,948
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN 2N-CH 120V BUMPED DIE
Cut Tape (CT) eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Dual) Common Source 120V 3.4A 60 mOhm @ 4A,5V 2.5V @ 700μA 0.8nC @ 5V 80pF @ 60V
EPC2110ENGRT
EPC
26,948
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN 2N-CH 120V BUMPED DIE
- eGaN -40°C ~ 150°C (TJ) Die Die Surface Mount - 2 N-Channel (Dual) Common Source 120V 3.4A 60 mOhm @ 4A,5V 2.5V @ 700μA 0.8nC @ 5V 80pF @ 60V
EPC2107
EPC
17,500
3 days
-
MOQ: 1  MPQ: 1
MOSFET 3 N-CH 100V 9BGA
Tape & Reel (TR) eGaN -40°C ~ 150°C (TJ) 9-VFBGA 9-BGA (1.35x1.35) Surface Mount - 3 N-Channel (Half Bridge + Synchronous Bootstrap) 100V 1.7A,500mA 320 mOhm @ 2A,5V,3.3 Ohm @ 2A,5V 2.5V @ 100μA,2.5V @ 20μA 0.16nC @ 5V,0.044nC @ 5V 16pF @ 50V,7pF @ 50V
EPC2107
EPC
19,431
3 days
-
MOQ: 1  MPQ: 1
MOSFET 3 N-CH 100V 9BGA
Cut Tape (CT) eGaN -40°C ~ 150°C (TJ) 9-VFBGA 9-BGA (1.35x1.35) Surface Mount - 3 N-Channel (Half Bridge + Synchronous Bootstrap) 100V 1.7A,500mA 320 mOhm @ 2A,5V,3.3 Ohm @ 2A,5V 2.5V @ 100μA,2.5V @ 20μA 0.16nC @ 5V,0.044nC @ 5V 16pF @ 50V,7pF @ 50V