Discover 82 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Series Operating Temperature Package / Case Supplier Device Package Power - Max FET Type FET Feature Current - Continuous Drain (Id) @ 25°C Rds On (Max) @ Id,Vgs Vgs(th) (Max) @ Id Gate Charge (Qg) (Max) @ Vgs Input Capacitance (Ciss) (Max) @ Vds
EPC2103ENGRT
EPC
5,500
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN SYM HALF BRDG 80V
Tape & Reel (TR) eGaN - Die Die - 2 N-Channel (Half Bridge) GaNFET (Gallium Nitride) 23A 5.5 mOhm @ 20A,5V 2.5V @ 7mA 6.5nC @ 5V 7600pF @ 40V
EPC2103ENGRT
EPC
5,884
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN SYM HALF BRDG 80V
Cut Tape (CT) eGaN - Die Die - 2 N-Channel (Half Bridge) GaNFET (Gallium Nitride) 23A 5.5 mOhm @ 20A,5V 2.5V @ 7mA 6.5nC @ 5V 7600pF @ 40V
EPC2103ENGRT
EPC
5,884
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN SYM HALF BRDG 80V
- eGaN - Die Die - 2 N-Channel (Half Bridge) GaNFET (Gallium Nitride) 23A 5.5 mOhm @ 20A,5V 2.5V @ 7mA 6.5nC @ 5V 7600pF @ 40V
IRF7380TRPBF
Infineon Technologies
8,000
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2N-CH 80V 3.6A 8-SOIC
Tape & Reel (TR) HEXFET -55°C ~ 150°C (TJ) 8-SOIC (0.154",3.90mm Width) 8-SO 2W 2 N-Channel (Dual) Logic Level Gate 3.6A 73 mOhm @ 2.2A,10V 4V @ 250μA 23nC @ 10V 660pF @ 25V
IRF7380TRPBF
Infineon Technologies
8,048
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2N-CH 80V 3.6A 8-SOIC
Cut Tape (CT) HEXFET -55°C ~ 150°C (TJ) 8-SOIC (0.154",3.90mm Width) 8-SO 2W 2 N-Channel (Dual) Logic Level Gate 3.6A 73 mOhm @ 2.2A,10V 4V @ 250μA 23nC @ 10V 660pF @ 25V
IRF7380TRPBF
Infineon Technologies
8,048
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2N-CH 80V 3.6A 8-SOIC
- HEXFET -55°C ~ 150°C (TJ) 8-SOIC (0.154",3.90mm Width) 8-SO 2W 2 N-Channel (Dual) Logic Level Gate 3.6A 73 mOhm @ 2.2A,10V 4V @ 250μA 23nC @ 10V 660pF @ 25V
FDS3890
ON Semiconductor
7,500
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2N-CH 80V 4.7A 8-SO
Tape & Reel (TR) PowerTrench -55°C ~ 175°C (TJ) 8-SOIC (0.154",3.90mm Width) 8-SO 900mW 2 N-Channel (Dual) Logic Level Gate 4.7A 44 mOhm @ 4.7A,10V 4V @ 250μA 35nC @ 10V 1180pF @ 40V
FDS3890
ON Semiconductor
9,284
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2N-CH 80V 4.7A 8-SO
Cut Tape (CT) PowerTrench -55°C ~ 175°C (TJ) 8-SOIC (0.154",3.90mm Width) 8-SO 900mW 2 N-Channel (Dual) Logic Level Gate 4.7A 44 mOhm @ 4.7A,10V 4V @ 250μA 35nC @ 10V 1180pF @ 40V
FDS3890
ON Semiconductor
9,284
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2N-CH 80V 4.7A 8-SO
- PowerTrench -55°C ~ 175°C (TJ) 8-SOIC (0.154",3.90mm Width) 8-SO 900mW 2 N-Channel (Dual) Logic Level Gate 4.7A 44 mOhm @ 4.7A,10V 4V @ 250μA 35nC @ 10V 1180pF @ 40V
FDS8935
ON Semiconductor
2,500
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2P-CH 80V 2.1A 8SOIC
Tape & Reel (TR) PowerTrench -55°C ~ 150°C (TJ) 8-SOIC (0.154",3.90mm Width) 8-SO 1.6W 2 P-Channel (Dual) Logic Level Gate 2.1A 183 mOhm @ 2.1A,10V 3V @ 250μA 19nC @ 10V 879pF @ 40V
FDS8935
ON Semiconductor
3,978
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2P-CH 80V 2.1A 8SOIC
Cut Tape (CT) PowerTrench -55°C ~ 150°C (TJ) 8-SOIC (0.154",3.90mm Width) 8-SO 1.6W 2 P-Channel (Dual) Logic Level Gate 2.1A 183 mOhm @ 2.1A,10V 3V @ 250μA 19nC @ 10V 879pF @ 40V
FDS8935
ON Semiconductor
3,978
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2P-CH 80V 2.1A 8SOIC
- PowerTrench -55°C ~ 150°C (TJ) 8-SOIC (0.154",3.90mm Width) 8-SO 1.6W 2 P-Channel (Dual) Logic Level Gate 2.1A 183 mOhm @ 2.1A,10V 3V @ 250μA 19nC @ 10V 879pF @ 40V
EPC2103
EPC
9,500
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN SYMMETRICAL HALF BRIDG
Tape & Reel (TR) eGaN -40°C ~ 150°C (TJ) Die Die - 2 N-Channel (Half Bridge) GaNFET (Gallium Nitride) 28A 5.5 mOhm @ 20A,5V 2.5V @ 7mA 6.5nC @ 5V 760pF @ 40V
EPC2103
EPC
9,995
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN SYMMETRICAL HALF BRIDG
Cut Tape (CT) eGaN -40°C ~ 150°C (TJ) Die Die - 2 N-Channel (Half Bridge) GaNFET (Gallium Nitride) 28A 5.5 mOhm @ 20A,5V 2.5V @ 7mA 6.5nC @ 5V 760pF @ 40V
EPC2103
EPC
9,995
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN SYMMETRICAL HALF BRIDG
- eGaN -40°C ~ 150°C (TJ) Die Die - 2 N-Channel (Half Bridge) GaNFET (Gallium Nitride) 28A 5.5 mOhm @ 20A,5V 2.5V @ 7mA 6.5nC @ 5V 760pF @ 40V
EPC2105
EPC
10,000
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN ASYMMETRICAL HALF BRID
Tape & Reel (TR) eGaN -40°C ~ 150°C (TJ) Die Die - 2 N-Channel (Half Bridge) GaNFET (Gallium Nitride) 9.5A,38A 14.5 mOhm @ 20A,5V,3.4 mOhm @ 20A,5V 2.5V @ 2.5mA,2.5V @ 10mA 2.5nC @ 5V,10nC @ 5V 300pF @ 40V,1100pF @ 40V
EPC2105
EPC
10,000
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN ASYMMETRICAL HALF BRID
Cut Tape (CT) eGaN -40°C ~ 150°C (TJ) Die Die - 2 N-Channel (Half Bridge) GaNFET (Gallium Nitride) 9.5A,38A 14.5 mOhm @ 20A,5V,3.4 mOhm @ 20A,5V 2.5V @ 2.5mA,2.5V @ 10mA 2.5nC @ 5V,10nC @ 5V 300pF @ 40V,1100pF @ 40V
EPC2105
EPC
10,000
3 days
-
MOQ: 1  MPQ: 1
TRANS GAN ASYMMETRICAL HALF BRID
- eGaN -40°C ~ 150°C (TJ) Die Die - 2 N-Channel (Half Bridge) GaNFET (Gallium Nitride) 9.5A,38A 14.5 mOhm @ 20A,5V,3.4 mOhm @ 20A,5V 2.5V @ 2.5mA,2.5V @ 10mA 2.5nC @ 5V,10nC @ 5V 300pF @ 40V,1100pF @ 40V
EPC2105ENGRT
EPC
5,500
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2NCH 80V 9.5A DIE
Tape & Reel (TR) eGaN -40°C ~ 150°C (TJ) Die Die - 2 N-Channel (Half Bridge) GaNFET (Gallium Nitride) 9.5A 14.5 mOhm @ 20A,5V 2.5V @ 2.5mA 2.5nC @ 5V 300pF @ 40V
EPC2105ENGRT
EPC
5,742
3 days
-
MOQ: 1  MPQ: 1
MOSFET 2NCH 80V 9.5A DIE
Cut Tape (CT) eGaN -40°C ~ 150°C (TJ) Die Die - 2 N-Channel (Half Bridge) GaNFET (Gallium Nitride) 9.5A 14.5 mOhm @ 20A,5V 2.5V @ 2.5mA 2.5nC @ 5V 300pF @ 40V