Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Discover 2 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
502006B00000G
Aavid, Thermal Division of Boyd Corporation
Inquiry
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
1.250" (31.75mm) 7.0W @ 50°C 4.00°C/W @ 200 LFM
501906B00000G
Aavid, Thermal Division of Boyd Corporation
Inquiry
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-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
1.000" (25.40mm) 4.0W @ 40°C 4.00°C/W @ 300 LFM