Thermal - Heat Sinks - Zui Ai Technology（Taiwan）Company.

Series：

Length：

Width：

Package Cooled：

Height Off Base (Height of Fin)：

Power Dissipation @ Temperature Rise：

Thermal Resistance @ Forced Air Flow：

Thermal Resistance @ Natural：

Image	Part Number	Manufacturer	Quantity	Delivery period	Unit Price	Buy	Description	Series	Length	Width	Package Cooled	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural
Image	Part Number	Manufacturer	Quantity	Delivery period	Unit Price	Buy	Description	Series	Length	Width	Package Cooled	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural
	HS09	Apex Microtechnology	688	3 days	-	HEATSINK TO3 MOQ: 1 MPQ: 1	HEATSINK TO3	Apex Precision Power	1.630" (41.40mm)	1.290" (32.77mm)	TO-3	0.750" (19.05mm)	7.0W @ 80°C	14.00°C/W @ 200 LFM	11.70°C/W
	501303B00000G	Aavid, Thermal Division of Boyd Corporation	5,511	3 days	-	HEAT SINK TO-3 .500" COMPACT MOQ: 1 MPQ: 1	HEAT SINK TO-3 .500" COMPACT	-	1.880" (47.75mm)	1.400" (35.56mm)	TO-3	0.500" (12.70mm)	2.0W @ 30°C	4.00°C/W @ 300 LFM	12.00°C/W
	501403B00000G	Aavid, Thermal Division of Boyd Corporation	1,707	3 days	-	HEAT SINK TO-3 .750" COMPACT MOQ: 1 MPQ: 1	HEAT SINK TO-3 .750" COMPACT	-	1.880" (47.75mm)	1.400" (35.56mm)	TO-3	0.750" (19.05mm)	4.0W @ 40°C	3.00°C/W @ 400 LFM	10.00°C/W
	501603B00000G	Aavid, Thermal Division of Boyd Corporation	2,970	3 days	-	HEAT SINK TO-3 1.25" COMPACT MOQ: 1 MPQ: 1	HEAT SINK TO-3 1.25" COMPACT	-	1.880" (47.75mm)	1.400" (35.56mm)	TO-3	1.250" (31.75mm)	4.0W @ 30°C	3.00°C/W @ 200 LFM	7.80°C/W
	501503B00000G	Aavid, Thermal Division of Boyd Corporation	6,006	3 days	-	HEATSINK TO-3 1.00" BLK MOQ: 1 MPQ: 1	HEATSINK TO-3 1.00" BLK	-	1.880" (47.75mm)	1.400" (35.56mm)	TO-3	1.000" (25.40mm)	5.0W @ 40°C	2.00°C/W @ 500 LFM	8.40°C/W
	502403B00000	Aavid, Thermal Division of Boyd Corporation	2,558	3 days	-	HEAT SINK 12W 1.25"H SPACE SAVER MOQ: 1 MPQ: 1	HEAT SINK 12W 1.25"H SPACE SAVER	-	1.630" (41.40mm)	1.290" (32.77mm)	-	1.250" (31.75mm)	-	-	-
	ATS-PCB1043	Advanced Thermal Solutions Inc.	2,884	3 days	-	HEATSINK TO-3 MOQ: 1 MPQ: 1	HEATSINK TO-3	-	2.507" (63.67mm)	1.867" (47.41mm)	TO-3	1.667" (42.33mm)	-	2.60°C/W @ 200 LFM	7.50°C/W
	LAE66A3CB	CTS Thermal Management Products	267	3 days	-	HEATSINK PWR .75"H BLACK TO-220 MOQ: 1 MPQ: 1	HEATSINK PWR .75"H BLACK TO-220	-	1.310" (33.27mm)	0.900" (22.86mm)	TO-126, TO-220	0.750" (19.05mm)	-	7.00°C/W @ 200 LFM	50.00°C/W
	575703B00000G	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	BOARD LEVEL HEAT SINK MOQ: 1 MPQ: 1	BOARD LEVEL HEAT SINK	-	1.630" (41.40mm)	1.290" (32.77mm)	TO-3	0.750" (19.05mm)	2.0W @ 30°C	4.00°C/W @ 200 LFM	13.40°C/W
	575603B00000G	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	BOARD LEVEL HEAT SINK MOQ: 1 MPQ: 1	BOARD LEVEL HEAT SINK	-	1.630" (41.40mm)	1.290" (32.77mm)	TO-3	0.500" (12.70mm)	3.0W @ 50°C	3.00°C/W @ 600 LFM	15.60°C/W
	575803B00000G	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	BOARD LEVEL HEAT SINK MOQ: 1 MPQ: 1	BOARD LEVEL HEAT SINK	-	1.630" (41.40mm)	1.290" (32.77mm)	TO-3	1.000" (25.40mm)	5.0W @ 50°C	3.50°C/W @ 200 LFM	11.00°C/W
	575903B00000G	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	BOARD LEVEL HEAT SINK MOQ: 1 MPQ: 1	BOARD LEVEL HEAT SINK	-	1.630" (41.40mm)	1.290" (32.77mm)	TO-3	1.250" (31.75mm)	7.0W @ 70°C	3.00°C/W @ 300 LFM	9.80°C/W
	502203B00000	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	HEAT SINK 6W/.75"H SPACE SAVER MOQ: 1 MPQ: 1	HEAT SINK 6W/.75"H SPACE SAVER	-	1.630" (41.40mm)	1.290" (32.77mm)	-	0.750" (19.05mm)	-	-	-
	502006B00000G	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	BOARD LEVEL HEAT SINK MOQ: 1 MPQ: 1	BOARD LEVEL HEAT SINK	-	1.550" (39.37mm)	1.040" (26.42mm)	TO-66	1.250" (31.75mm)	7.0W @ 50°C	4.00°C/W @ 200 LFM	8.00°C/W
	501706B00000G	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	BOARD LEVEL HEAT SINK MOQ: 1 MPQ: 1	BOARD LEVEL HEAT SINK	-	1.550" (39.37mm)	1.040" (26.42mm)	TO-66	0.500" (12.70mm)	2.0W @ 30°C	7.00°C/W @ 200 LFM	10.70°C/W
	501806B00000G	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	BOARD LEVEL HEAT SINK MOQ: 1 MPQ: 1	BOARD LEVEL HEAT SINK	-	1.550" (39.37mm)	1.040" (26.42mm)	TO-66	0.750" (19.05mm)	6.0W @ 60°C	2.00°C/W @ 800 LFM	9.60°C/W
	501906B00000G	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	BOARD LEVEL HEAT SINK MOQ: 1 MPQ: 1	BOARD LEVEL HEAT SINK	-	1.550" (39.37mm)	1.040" (26.42mm)	TO-66	1.000" (25.40mm)	4.0W @ 40°C	4.00°C/W @ 300 LFM	8.00°C/W
	502303B00000	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	HEAT SINK 8W/1.00"H SPACE SAVER MOQ: 1 MPQ: 1	HEAT SINK 8W/1.00"H SPACE SAVER	-	1.630" (41.40mm)	1.290" (32.77mm)	-	1.000" (25.40mm)	-	-	-
	579003B00000G	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	BOARD LEVEL HEAT SINK MOQ: 1 MPQ: 1	BOARD LEVEL HEAT SINK	-	1.830" (46.48mm)	1.830" (46.48mm)	TO-3	1.000" (25.40mm)	4.0W @ 30°C	3.50°C/W @ 200 LFM	6.00°C/W
	520103B00000G	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	BOARD LEVEL HEAT SINK MOQ: 1 MPQ: 1	BOARD LEVEL HEAT SINK	-	1.550" (39.37mm)	1.550" (39.37mm)	TO-3	1.225" (31.12mm)	5.0W @ 30°C	3.00°C/W @ 200 LFM	5.40°C/W

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