- Material:
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- Length:
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- Width:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Selected conditions:
Discover 20 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Aavid, Thermal Division of Boyd Corporation |
18,195
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.5W LOW PROFILE
|
Board Level | Aluminum | 0.750" (19.05mm) | 0.750" (19.05mm) | Bolt On | TO-220 | 0.380" (9.65mm) | 2.5W @ 60°C | 10.00°C/W @ 200 LFM | 24.00°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
6,852
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
BRIDGE RECTIFIER HEATSINK 0.142"
|
Board Level | Aluminum | 1.060" (26.92mm) | 1.060" (26.92mm) | Bolt On | Bridge Rectifiers | 1.250" (31.75mm) | 3.0W @ 30°C | 3.00°C/W @ 400 LFM | 9.40°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
5,589
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
BRIDGE RECTIFIER HEATSINK 0.163"
|
Board Level | Aluminum | 1.060" (26.92mm) | 1.060" (26.92mm) | Bolt On | Bridge Rectifiers | 1.250" (31.75mm) | 3.0W @ 30°C | 3.00°C/W @ 400 LFM | 9.40°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
1,518
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 1.75" HI RISE TO-218
|
Board Level, Vertical | Aluminum | 1.750" (44.45mm) | 0.490" (12.44mm) | Clip and Board Mounts | TO-218 | 1.750" (44.45mm) | 4.0W @ 30°C | 1.50°C/W @ 400 LFM | 6.30°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
2,002
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 1.75" HIGH RISE TO-220
|
Board Level, Vertical | Aluminum | 1.750" (44.45mm) | 0.490" (12.44mm) | Clip and Board Mounts | TO-220 | 1.750" (44.45mm) | 4.0W @ 30°C | 1.50°C/W @ 400 LFM | 6.30°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
114
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 50X50X14MM
|
Top Mount | Copper | 1.969" (50.00mm) | 1.969" (50.00mm) | Push Pin | BGA | 0.551" (14.00mm) | - | 2.10°C/W @ 200 LFM | 8.90°C/W | AavSHIELD 3C | ||||
Aavid, Thermal Division of Boyd Corporation |
125
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 90X90X10MM
|
Top Mount | Copper | 3.543" (90.00mm) | 3.543" (90.00mm) | Push Pin | BGA | 0.394" (10.00mm) | - | 1.30°C/W @ 200 LFM | 4.50°C/W | AavSHIELD 3C | ||||
Aavid, Thermal Division of Boyd Corporation |
82
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 60X60X22MM
|
Top Mount | Copper | 2.362" (60.00mm) | 2.362" (60.00mm) | Push Pin | BGA | 0.866" (22.00mm) | - | 0.80°C/W @ 300 LFM | 7.20°C/W | AavSHIELD 3C | ||||
Aavid, Thermal Division of Boyd Corporation |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 45X44X22.5MM
|
Top Mount | Copper | 1.732" (44.00mm) | 1.772" (45.00mm) | Push Pin | BGA | 0.886" (22.50mm) | - | 1.65°C/W @ 200 LFM | 8.00°C/W | AavSHIELD 3C | ||||
Aavid, Thermal Division of Boyd Corporation |
88
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 40X40.5X13.5MM
|
Top Mount | Copper | 1.594" (40.50mm) | 1.575" (40.00mm) | Push Pin | BGA | 0.531" (13.49mm) | - | 2.50°C/W @ 200 LFM | 13.30°C/W | AavSHIELD 3C | ||||
Aavid, Thermal Division of Boyd Corporation |
75
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 60X60X14MM
|
Top Mount | Copper | 2.362" (60.00mm) | 2.362" (60.00mm) | Push Pin | BGA | 0.551" (14.00mm) | - | 1.70°C/W @ 200 LFM | 7.00°C/W | AavSHIELD 3C | ||||
Aavid, Thermal Division of Boyd Corporation |
80
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 70X69X14MM
|
Top Mount | Copper | 2.717" (69.00mm) | 2.756" (70.00mm) | Push Pin | BGA | 0.551" (14.00mm) | - | 1.40°C/W @ 200 LFM | 5.60°C/W | AavSHIELD 3C | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 80X80X12MM
|
Top Mount | Copper | 3.150" (80.00mm) | 3.150" (80.00mm) | Push Pin | BGA | 0.472" (12.00mm) | - | 1.20°C/W @ 200 LFM | 5.10°C/W | AavSHIELD 3C | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-3 | 0.470" (11.94mm) | 3.0W @ 40°C | 3.00°C/W @ 400 LFM | 9.40°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-3 | 0.750" (19.05mm) | 2.0W @ 20°C | 2.50°C/W @ 400 LFM | - | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-220 (Dual) | 0.720" (18.29mm) | 3.0W @ 30°C | 3.00°C/W @ 300 LFM | 8.70°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BGA HEAT SINK
|
Top Mount | Aluminum | 0.985" (25.02mm) | 0.985" (25.02mm) | Thermal Tape, Adhesive (Included) | BGA | 0.390" (9.91mm) | - | 5.30°C/W @ 200 LFM | 10.00°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | 1.750" (44.45mm) | 0.490" (12.44mm) | Bolt On and Board Mounts | TO-218, TO-247 | 1.750" (44.45mm) | 4.0W @ 30°C | 1.50°C/W @ 400 LFM | 6.30°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-3 | 1.220" (31.00mm) | 4.0W @ 30°C | 2.00°C/W @ 400 LFM | 6.60°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | 0.655" (16.64mm) | 0.655" (16.64mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.265" (6.73mm) | 1.0W @ 40°C | 17.50°C/W @ 300 LFM | - | Black Anodized |