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Discover 46 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Comair Rotron |
360
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 10X21.2X19MM
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Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.835" (21.21mm) | Bolt On and PC Pin | TO-220 | 0.394" (10.00mm) | 3.0W @ 60°C | 12.00°C/W @ 200 LFM | Black Anodized | ||
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Comair Rotron |
924
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 10X21.2X19MM
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Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.835" (21.21mm) | Bolt On and PC Pin | TO-220 | 0.394" (10.00mm) | 3.0W @ 60°C | 12.00°C/W @ 200 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 9.5X22.8X17.8MM
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Board Level, Vertical | Aluminum | 0.700" (17.78mm) | 0.900" (22.86mm) | Clip | TO-220 | 0.375" (9.52mm) | 2.0W @ 50°C | 14.00°C/W @ 200 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUD 12.7X34.9X38.1MM
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Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-220, TO-202 | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 25X41.6X50.8MM
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Board Level, Vertical | Aluminum | 2.000" (50.80mm) | 1.638" (41.60mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 0.984" (25.00mm) | 6.0W @ 30°C | 1.50°C/W @ 500 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 9.5X22X28MM
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Board Level, Vertical | Copper | 1.100" (27.94mm) | 0.866" (22.00mm) | Clip and PC Pin | TO-220 | 0.375" (9.52mm) | 1.5W @ 40°C | 8.00°C/W @ 400 LFM | Tin | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 13.1X13.2X24MM
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Board Level, Vertical | Copper | 0.848" (21.55mm) | 0.520" (13.21mm) | Clip and PC Pin | TO-220 | 0.515" (13.08mm) | 0.5W @ 20°C | 12.00°C/W @ 500 LFM | Tin | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 25X41.6X38.1MM
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Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 1.638" (41.60mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 0.984" (25.00mm) | 8.0W @ 40°C | 1.50°C/W @ 700 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 25X41.6X38.1MM
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Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.000" (25.40mm) | 10.0W @ 50°C | 1.50°C/W @ 700 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 36.8X19.8X21.6MM
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Board Level | Aluminum | 1.450" (36.83mm) | 0.779" (19.80mm) | Bolt On | TO-220 | 0.850" (21.60mm) | 4.0W @ 40°C | 5.00°C/W @ 200 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 24.1X48.3X23.6
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Board Level, Vertical | Aluminum | 0.930" (23.62mm) | 1.900" (48.26mm) | Bolt On and PC Pin | TO-220 | 0.950" (24.13mm) | 2.0W @ 20°C | 4.00°C/W @ 300 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.4X12.7X30MM
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Board Level, Vertical | Copper | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | Tin | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19.4X25.4X11.4MM
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Board Level | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | Tin | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 9.7X44.5X36.8MM
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Board Level, Vertical | Aluminum | 1.450" (36.83mm) | 1.750" (44.45mm) | Bolt On and PC Pin | TO-220 | 0.380" (9.65mm) | 3.0W @ 30°C | 4.00°C/W @ 300 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 12.7X34.9X50.8MM
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Board Level, Vertical | Aluminum | 2.000" (50.80mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 0.500" (12.70mm) | 2.0W @ 20°C | 4.50°C/W @ 200 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.9X15X9.5MM
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Board Level | Copper | 0.590" (14.99mm) | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak) | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | Tin | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 24.1X48.3X49.5MM
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Board Level, Vertical | Aluminum | 1.950" (49.53mm) | 1.900" (48.26mm) | Bolt On and PC Pin | TO-220 | 0.950" (24.13mm) | 3.0W @ 20°C | 2.50°C/W @ 400 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
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Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 0.997" (25.33mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.4X12.7X30MM
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Board Level, Vertical | Aluminum | 0.942" (23.92mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | Black Anodized | ||
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Comair Rotron |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.4X12.7X30MM
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Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | Black Anodized |
