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Discover 1,563 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
6,500
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220
|
- | Top Mount | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | TO-263 (D2Pak) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Top Mount | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | TO-263 (D2Pak) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
|
|
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Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Top Mount | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | TO-263 (D2Pak) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,216
|
3 days |
-
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MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .45" D2PAK
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- | Top Mount | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | TO-263 (D2Pak) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
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Wakefield-Vette |
5,421
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK DC/DC HALF BRICK VERT
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528 | Board Level | Aluminum | 2.402" (61.00mm) | 2.280" (57.91mm) | Bolt On | Half Brick DC/DC Converter | 7.0W @ 60°C | 3.20°C/W @ 300 LFM | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
10,857
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SLIDE-ON 8-DIP
|
- | Top Mount | Aluminum | 0.562" (14.27mm) | 0.600" (15.24mm) | Press Fit, Slide On | 8-DIP | 1.0W @ 30°C | 8.00°C/W @ 500 LFM | 30.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
117
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM FP
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 21.46°C/W @ 100 LFM | - | Blue Anodized | |||
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CUI Inc. |
1,950
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 19.
|
- | Board Level | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | - | TO-220 | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | ||
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CUI Inc. |
2,094
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
- | Board Level | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | - | TO-220 | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | ||
|
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CUI Inc. |
2,094
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
- | Board Level | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | - | TO-220 | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | ||
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ASSMANN WSW Components |
626
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 19.38X25.40MM
|
- | Top Mount | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | TO-263 (D2Pak) | - | - | 23.00°C/W | Tin | ||
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Advanced Thermal Solutions Inc. |
61
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X11.43MM FP
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 14.56°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
93
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM T766
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 21.46°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
97
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X11.43MM T766
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 14.56°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
85
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM T766
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 21.46°C/W @ 100 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM T766
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 14.82°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
95
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM T766
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 21.46°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
97
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM T766
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 14.82°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
94
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM T766
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 14.82°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X11.43MM T766
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 14.56°C/W @ 100 LFM | - | Blue Anodized |
