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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Top Mount | Aluminum | 0.602" (15.29mm) | - | Press Fit | TO-92 | 1.220" (31.00mm) | 20.00°C/W @ 200 LFM | 40.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Copper | 1.025" (26.04mm) | 1.005" (25.53mm) | Clip and PC Pin | TO-218 | 0.610" (15.49mm) | 4.00°C/W @ 500 LFM | 23.10°C/W | Tin | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 13.1X13.2X24MM
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Board Level, Vertical | Copper | 0.848" (21.55mm) | 0.520" (13.21mm) | Clip and PC Pin | TO-220 | 0.515" (13.08mm) | 12.00°C/W @ 500 LFM | - | Tin |
