- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Selected conditions:
Discover 4 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
11,699
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
|
Top Mount | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | ||
|
|
|
CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 14.
|
Top Mount | - | TO-263 (D2Pak) | 2.1W @ 75°C | 8.15°C/W @ 200 LFM | 35.71°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
|
Top Mount | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | ||
|
|
|
Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.9X15X9.5MM
|
Board Level | SMD Pad | TO-263 (D2Pak) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - |
