- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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TO-220 | 1.5W @ 40°C | 5.00°C/W @ 500 LFM | 20.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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TO-218 | 0.5W @ 20°C | 4.00°C/W @ 500 LFM | 23.10°C/W |
