- Material：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Selected conditions:
Discover 4,136 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Wakefield-Vette |
887
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL TO HEATSINK 32X58MM
|
OmniKlip | Board Level, Vertical | Aluminum | 1.250" (31.75mm) | Clip, Solder Foot | TO-247, TO-264 | 1.823" (46.30mm) | - | - | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
122
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X5.84MM FP
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 25.25°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
117
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM FP
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 21.46°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
171
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X22.86MM FP
|
pushPIN | Top Mount | Aluminum | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 7.31°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
93
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM FP
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 14.33°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
63
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X5.84MM FP
|
pushPIN | Top Mount | Aluminum | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 18.94°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
62
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X17.78MM FP
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 17.42°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
61
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X11.43MM FP
|
pushPIN | Top Mount | Aluminum | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 14.56°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
92
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X17.78MM FP
|
pushPIN | Top Mount | Aluminum | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 10.03°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
97
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X5.84MM T766
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 25.25°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
93
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM T766
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 21.46°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
92
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM T766
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 14.33°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
97
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X11.43MM T766
|
pushPIN | Top Mount | Aluminum | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 14.56°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
95
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X5.84MM T766
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 25.25°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
85
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM T766
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 21.46°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
94
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X17.78MM T766
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 17.42°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
94
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM T766
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 14.33°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
73
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X22.86MM T766
|
pushPIN | Top Mount | Aluminum | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 7.31°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
99
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X17.78MM T766
|
pushPIN | Top Mount | Aluminum | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 10.03°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
95
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM T766
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 21.46°C/W @ 100 LFM | - | Blue Anodized |
