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Discover 10 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
3,250
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D-PAK3 TIN PLATED SMD
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- | Top Mount | Copper | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D-PAK3 TIN PLATED SMD
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- | Top Mount | Copper | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
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Ohmite |
1,763
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-268 BLACK
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D | Top Mount | Aluminum | 0.500" (12.70mm) | Solderable Feet | TO-268 | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized | ||
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Apex Microtechnology |
31
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT
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Apex Precision Power | Top Mount | Copper | 0.500" (12.70mm) | SMD Pad | SMD | 0.400" (10.16mm) | - | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable | ||
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Advanced Thermal Solutions Inc. |
605
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218/TO-220 BLACK
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- | Board Level, Vertical | Aluminum | 1.772" (45.00mm) | Bolt On and PC Pin | TO-220, TO-218 | 0.500" (12.70mm) | - | 9.00°C/W @ 200 LFM | 13.00°C/W | Black Anodized | |||
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Ohmite |
5
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-268
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D | Top Mount | Aluminum | 0.500" (12.70mm) | Solderable Feet | TO-268 | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Top Mount | - | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
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Ohmite |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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TO-268 HEAT SINK /POLY TAPE
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D | Top Mount | Aluminum | 0.500" (12.70mm) | Solderable Feet | TO-268 | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | ||
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Ohmite |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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TO-268 HEAT SINK /POLY TAPE
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D | Top Mount | Aluminum | 0.500" (12.70mm) | Solderable Feet | TO-268 | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized |
