- Manufacturer：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 7 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
4,765
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB FOLD 28.7MM
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1.130" (28.70mm) | 6.0W @ 50°C | 4.00°C/W @ 300 LFM | 6.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
5,947
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3 days |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK 1.95" TO220
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1.950" (49.53mm) | 3.0W @ 20°C | 2.50°C/W @ 400 LFM | 4.40°C/W | ||
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Advanced Thermal Solutions Inc. |
1,409
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TAB BLACK
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1.130" (28.70mm) | - | 4.90°C/W @ 200 LFM | 6.80°C/W | |||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.130" (28.70mm) | 6.0W @ 50°C | 4.00°C/W @ 300 LFM | 6.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.950" (49.53mm) | 5.0W @ 30°C | 2.50°C/W @ 400 LFM | 4.40°C/W | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 24.1X48.3X23.6
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0.930" (23.62mm) | 2.0W @ 20°C | 4.00°C/W @ 300 LFM | - | ||
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Comair Rotron |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 24.1X48.3X49.5MM
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1.950" (49.53mm) | 3.0W @ 20°C | 2.50°C/W @ 400 LFM | - |
