- Manufacturer：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 30 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
Advanced Thermal Solutions Inc. |
2,885
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON
|
Board Level | 0.748" (19.00mm) | Clip | TO-220 | 0.504" (12.80mm) | - | 4.40°C/W @ 200 LFM | 27.30°C/W | |||
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ASSMANN WSW Components |
2,812
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 15X12.8MM
|
Board Level | 0.591" (15.01mm) | Press Fit | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | 14.00°C/W @ 200 LFM | - | ||
|
|
|
ASSMANN WSW Components |
9,919
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 19X12.80MM
|
Board Level | 0.748" (19.00mm) | Press Fit | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | 14.00°C/W @ 200 LFM | - | ||
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|
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ASSMANN WSW Components |
1,389
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK BLK ANOD ALUM TO-220
|
Board Level | 1.500" (38.10mm) | Press Fit | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | - | ||
|
|
|
ASSMANN WSW Components |
1,970
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ANOD ALUM TO-220
|
Board Level, Vertical | 0.591" (15.01mm) | PC Pin | TO-220 | 0.500" (12.70mm) | - | - | 26.00°C/W | ||
|
|
|
ASSMANN WSW Components |
5,025
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 19X12.8MM
|
Board Level, Vertical | 0.748" (19.00mm) | Press Fit and PC Pin | TO-220 | 0.500" (12.70mm) | - | - | 21.00°C/W | ||
|
|
|
ASSMANN WSW Components |
3,369
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 19X12.8MM
|
Board Level, Vertical | 0.748" (19.00mm) | Press Fit and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | - | ||
|
|
|
ASSMANN WSW Components |
1,201
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ANOD ALUM TO-220
|
Board Level | 0.748" (19.00mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | 6.00°C/W @ 600 LFM | 21.00°C/W | ||
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|
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ASSMANN WSW Components |
1,630
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM WITH PIN TO-220
|
Board Level | 1.500" (38.10mm) | PC Pin | TO-220 | 0.500" (12.70mm) | - | - | 16.00°C/W | ||
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Advanced Thermal Solutions Inc. |
3,313
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON BLACK
|
Board Level | 0.748" (19.00mm) | Clip | TO-220 | 0.500" (12.70mm) | - | 10.20°C/W @ 200 LFM | 27.30°C/W | |||
|
|
Advanced Thermal Solutions Inc. |
2,962
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO262 CLIP W/TAB
|
Board Level, Vertical | 0.748" (19.00mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | - | 10.20°C/W @ 200 LFM | 27.30°C/W | |||
|
|
Advanced Thermal Solutions Inc. |
1,985
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-262 W/TAB
|
Board Level, Vertical | 0.748" (19.00mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | - | 10.20°C/W @ 200 LFM | 27.30°C/W | |||
|
|
Advanced Thermal Solutions Inc. |
1,867
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIPON W/TAB
|
Board Level, Vertical | 0.748" (19.00mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | - | 10.20°C/W @ 200 LFM | 27.30°C/W | |||
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CUI Inc. |
994
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.9W ALUMINUM
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Board Level | 0.748" (19.00mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | ||
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CUI Inc. |
986
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.9W ALUMINUM
|
Board Level, Vertical | 0.500" (12.70mm) | PC Pin | TO-220 | 0.748" (19.00mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | ||
|
|
|
CUI Inc. |
995
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.3W ALUMINUM
|
Board Level | 0.591" (15.00mm) | - | TO-220 | 0.500" (12.70mm) | 2.3W @ 75°C | 11.04°C/W @ 200 LFM | 33.28°C/W | ||
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|
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CUI Inc. |
972
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.9W ALUMINUM
|
Board Level, Vertical | 0.500" (12.70mm) | PC Pin | TO-220 | 0.748" (19.00mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | ||
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|
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CUI Inc. |
996
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.3W ALUMINUM
|
Board Level, Vertical | 0.500" (12.70mm) | PC Pin | TO-220 | 0.590" (15.00mm) | 2.3W @ 75°C | 11.04°C/W @ 200 LFM | 33.28°C/W | ||
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CUI Inc. |
998
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.9W ALUMINUM
|
Board Level | 0.748" (19.00mm) | - | TO-220 | 0.500" (12.70mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | ||
|
|
|
CUI Inc. |
475
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4W ALUMINUM
|
Board Level, Vertical | 1.500" (38.10mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 4.0W @ 75°C | 5.01°C/W @ 200 LFM | 18.63°C/W |
