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Discover 39 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CTS Thermal Management Products |
3,997
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE .91"SQ
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BDN | Top Mount | 0.910" (23.11mm) | 0.910" (23.11mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 9.60°C/W @ 400 LFM | 26.90°C/W | ||
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CTS Thermal Management Products |
2,354
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.11"SQ
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BDN | Top Mount | 1.110" (28.19mm) | 1.110" (28.19mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 7.20°C/W @ 400 LFM | 20.90°C/W | ||
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CTS Thermal Management Products |
1,776
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.41"SQ
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BDN | Top Mount | 1.410" (35.81mm) | 1.410" (35.81mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 5.60°C/W @ 400 LFM | 16.20°C/W | ||
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CTS Thermal Management Products |
192
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.21"SQ
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BDN | Top Mount | 1.210" (30.73mm) | 1.210" (30.73mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 6.80°C/W @ 400 LFM | 19.60°C/W | ||
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CTS Thermal Management Products |
1,248
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK PWR MED-HI BLACK TO-3
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- | Board Level | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-3 | 1.000" (25.40mm) | - | - | 9.00°C/W | ||
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CTS Thermal Management Products |
661
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.21"SQ
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BDN | Top Mount | 1.210" (30.73mm) | 1.210" (30.73mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.555" (14.10mm) | - | 5.20°C/W @ 400 LFM | 16.50°C/W | ||
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CTS Thermal Management Products |
652
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.31"SQ
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BDN | Top Mount | 1.310" (33.27mm) | 1.310" (33.27mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 6.00°C/W @ 400 LFM | 16.10°C/W | ||
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CTS Thermal Management Products |
377
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.81"SQ
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BDN | Top Mount | 1.810" (45.97mm) | 1.810" (45.97mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.605" (15.37mm) | - | 2.80°C/W @ 400 LFM | 8.10°C/W | ||
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CTS Thermal Management Products |
979
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.81"SQ
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BDN | Top Mount | 1.810" (45.97mm) | 1.810" (45.97mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 3.50°C/W @ 400 LFM | 10.80°C/W | ||
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CTS Thermal Management Products |
546
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.61"SQ
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BDN | Top Mount | 1.610" (40.89mm) | 1.610" (40.89mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 4.50°C/W @ 400 LFM | 13.50°C/W | ||
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CTS Thermal Management Products |
360
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/THERMAL TAPE
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APR | Top Mount | 1.047" (26.60mm) | 1.047" (26.60mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 5.30°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
3,767
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU .91" SQ
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BDN | Top Mount | 0.910" (23.11mm) | 0.910" (23.11mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 9.60°C/W @ 400 LFM | 26.90°C/W | |||
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CTS Thermal Management Products |
113
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.71"SQ
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BDN | Top Mount | 1.710" (43.43mm) | 1.710" (43.43mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 3.80°C/W @ 400 LFM | 11.50°C/W | ||
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CTS Thermal Management Products |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.01"SQ
|
BDN | Top Mount | 1.010" (25.65mm) | 1.010" (25.65mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 8.00°C/W @ 400 LFM | 26.40°C/W | ||
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CTS Thermal Management Products |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.51"SQ
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BDN | Top Mount | 1.510" (38.35mm) | 1.510" (38.35mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 4.50°C/W @ 400 LFM | 15.10°C/W | ||
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CTS Thermal Management Products |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/THERMAL TAPE
|
APR | Top Mount | 1.283" (32.60mm) | 1.283" (32.60mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.80°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
|
APR | Top Mount | 1.366" (34.70mm) | 1.366" (34.70mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.50°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/THERMAL TAPE
|
APR | Top Mount | 1.461" (37.10mm) | 1.461" (37.10mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.30°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK PWR HORZ.750"H BLK TO-3
|
7 | Board Level | 1.500" (38.10mm) | 1.500" (38.10mm) | Bolt On | TO-3 | 0.750" (19.05mm) | 6.0W @ 40°C | - | - | ||
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CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PWR .90"H BLACK TO-3
|
HP1 | Board Level | 2.500" (63.50mm) | 2.500" (63.50mm) | Bolt On | TO-3 | 0.900" (22.86mm) | - | - | 5.40°C/W |
