- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Apex Microtechnology |
381
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 8P TO-3 4.5C/W
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1.810" (45.97mm) | 1.810" (45.97mm) | TO-3 | 1.500" (38.10mm) | 10.0W @ 50°C | 2.00°C/W @ 300 LFM | 4.50°C/W | ||
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Apex Microtechnology |
2
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 6P DIP
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2.500" (63.50mm) | 2.500" (63.50mm) | 6-DIP | 0.900" (22.86mm) | 3.0W @ 20°C | 30.00°C/W @ 500 LFM | 5.60°C/W |
