- Type：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Selected conditions:
Discover 2 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
.5X.25X.34 HEATSINK FOR DIODE
|
258 | Board Level | Aluminum | 0.250" (6.35mm) | 0.500" (12.70mm) | Type 120 Compound | Stud Mounted Diode | 0.340" (8.64mm) | - | - | 12.00°C/W | - | |||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK DPAK SMT TIN PLATED
|
217 | Top Mount | Copper | 0.740" (18.80mm) | 0.600" (15.24mm) | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin |
