- Manufacturer：
-
- Material：
-
- Length：
-
- Width：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Selected conditions:
Discover 21 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
t-Global Technology |
166
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3 101.6X38.1X0.21MM
|
PH3 | Heat Spreader | Copper | 4.000" (101.60mm) | 1.500" (38.10mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
385
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 50.8X12.07X0.062MM
|
PH3n | Heat Spreader | Copper | 2.000" (50.80mm) | 0.500" (12.70mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | Polyester | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
11
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
68855 EXTRUSION 0.46X7.201"X4
|
- | Top Mount | Aluminum | 48.000" (1219.20mm) | 7.200" (182.88mm) | - | 0.460" (11.68mm) | 0.50°C/W @ 500 LFM | - | - | ||
|
|
|
t-Global Technology |
238
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 50.8X12.07X0.07MM
|
PH3n | Heat Spreader | Copper | 2.000" (50.80mm) | 0.500" (12.70mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
116
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3 50.8X12.07X0.21MM
|
PH3 | Heat Spreader | Copper | 2.000" (50.80mm) | 0.500" (12.70mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
120
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X25.4X0.062MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | 1.000" (25.40mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3 76.2X19.1X0.21MM
|
PH3 | Heat Spreader | Copper | 3.000" (76.20mm) | 0.750" (19.05mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
76
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X38.1X0.062MM
|
PH3n | Heat Spreader | Copper | 4.000" (101.60mm) | 1.500" (38.10mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X38.1X0.07MM
|
PH3n | Heat Spreader | Copper | 4.000" (101.60mm) | 1.500" (38.10mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
78
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3 101.6X25.4X0.21MM
|
PH3 | Heat Spreader | Copper | 4.000" (101.60mm) | 1.000" (25.40mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | Polyester | ||
|
|
Aavid, Thermal Division of Boyd Corporation |
10
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
60340 EXTRUSION 1.312X6.437"X4
|
- | Top Mount | Aluminum | 48.000" (1219.20mm) | - | - | 1.312" (33.32mm) | - | - | - | |||
|
|
|
t-Global Technology |
51
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X12.07X0.062MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | 0.500" (12.70mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
21
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X12.07X0.07MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | 0.500" (12.70mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
49
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X19.1X0.062MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | 0.750" (19.05mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
11
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X19.1X0.07MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | 0.750" (19.05mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
44
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X25.4X0.07MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | 1.000" (25.40mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
24
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3 76.2X12.07X0.21MM
|
PH3 | Heat Spreader | Copper | 3.000" (76.20mm) | 0.500" (12.70mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
9
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X25.4X0.062MM
|
PH3n | Heat Spreader | Copper | 4.000" (101.60mm) | 1.000" (25.40mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
7
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X25.4X0.07MM
|
PH3n | Heat Spreader | Copper | 4.000" (101.60mm) | 1.000" (25.40mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
20
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3 76.2X25.4X0.21MM
|
PH3 | Heat Spreader | Copper | 3.000" (76.20mm) | 1.000" (25.40mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | Polyester |
