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- Length:
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- Attachment Method:
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Discover 265 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
t-Global Technology |
166
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3 101.6X38.1X0.21MM
|
PH3 | Heat Spreader | Copper | 4.000" (101.60mm) | 1.500" (38.10mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | Polyester | ||||
CTS Thermal Management Products |
2,818
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PRESS ON .25"H BLK TO-5
|
7 | Top Mount | Aluminum | 0.700" (17.78mm) | 0.325" (8.26mm) | Press Fit | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | 58.00°C/W | Black Anodized | ||||
American Technical Ceramics |
2,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | 13.00°C/W | - | ||||
American Technical Ceramics |
2,800
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | 13.00°C/W | - | ||||
American Technical Ceramics |
2,800
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | 13.00°C/W | - | ||||
American Technical Ceramics |
7,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | - | 7.00°C/W | - | ||||
American Technical Ceramics |
7,836
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | - | 7.00°C/W | - | ||||
American Technical Ceramics |
7,836
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | - | 7.00°C/W | - | ||||
American Technical Ceramics |
500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.110" (2.79mm) | 0.110" (2.79mm) | SMD Pad | - | 0.040" (1.02mm) | - | 7.00°C/W | - | ||||
American Technical Ceramics |
936
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.110" (2.79mm) | 0.110" (2.79mm) | SMD Pad | - | 0.040" (1.02mm) | - | 7.00°C/W | - | ||||
American Technical Ceramics |
936
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.110" (2.79mm) | 0.110" (2.79mm) | SMD Pad | - | 0.040" (1.02mm) | - | 7.00°C/W | - | ||||
American Technical Ceramics |
250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.370" (9.40mm) | 0.245" (6.22mm) | SMD Pad | - | 0.060" (1.52mm) | - | 6.00°C/W | - | ||||
American Technical Ceramics |
250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | - | 0.245" (6.22mm) | SMD Pad | - | 0.060" (1.52mm) | - | 6.00°C/W | - | ||||
American Technical Ceramics |
250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | - | 0.245" (6.22mm) | SMD Pad | - | 0.060" (1.52mm) | - | 6.00°C/W | - | ||||
American Technical Ceramics |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | 20.00°C/W | - | ||||
American Technical Ceramics |
1,990
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | 20.00°C/W | - | ||||
American Technical Ceramics |
1,990
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | 20.00°C/W | - | ||||
American Technical Ceramics |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | 20.00°C/W | - | ||||
American Technical Ceramics |
1,345
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | 20.00°C/W | - | ||||
American Technical Ceramics |
1,345
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | 20.00°C/W | - |