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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | 0.860" (21.84mm) | Clip and PC Pin | 0.395" (10.03mm) | 2.0W @ 50°C | 8.00°C/W @ 500 LFM | 23.20°C/W | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 10X21.2X19MM
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Board Level | 0.860" (21.84mm) | Bolt On | 0.355" (9.02mm) | 3.0W @ 60°C | 12.00°C/W @ 200 LFM | - | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 10X21.2X19MM
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Board Level, Vertical | 0.835" (21.21mm) | Bolt On and PC Pin | 0.394" (10.00mm) | 3.0W @ 60°C | 12.00°C/W @ 200 LFM | - |
