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- Selected conditions:
Discover 19 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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t-Global Technology |
166
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3 days |
-
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MOQ: 1 MPQ: 1
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PH3 101.6X38.1X0.21MM
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PH3 | Heat Spreader | 4.000" (101.60mm) | 1.500" (38.10mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
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t-Global Technology |
385
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 50.8X12.07X0.062MM
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PH3n | Heat Spreader | 2.000" (50.80mm) | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
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t-Global Technology |
238
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 50.8X12.07X0.07MM
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PH3n | Heat Spreader | 2.000" (50.80mm) | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
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t-Global Technology |
116
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3 50.8X12.07X0.21MM
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PH3 | Heat Spreader | 2.000" (50.80mm) | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
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t-Global Technology |
120
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 76.2X25.4X0.062MM
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PH3n | Heat Spreader | 3.000" (76.20mm) | 1.000" (25.40mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
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t-Global Technology |
160
|
3 days |
-
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MOQ: 1 MPQ: 1
|
PH3 76.2X19.1X0.21MM
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PH3 | Heat Spreader | 3.000" (76.20mm) | 0.750" (19.05mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
|
|
|
t-Global Technology |
76
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X38.1X0.062MM
|
PH3n | Heat Spreader | 4.000" (101.60mm) | 1.500" (38.10mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
|
|
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t-Global Technology |
60
|
3 days |
-
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MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X38.1X0.07MM
|
PH3n | Heat Spreader | 4.000" (101.60mm) | 1.500" (38.10mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
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|
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t-Global Technology |
78
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3 101.6X25.4X0.21MM
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PH3 | Heat Spreader | 4.000" (101.60mm) | 1.000" (25.40mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
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|
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t-Global Technology |
51
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X12.07X0.062MM
|
PH3n | Heat Spreader | 3.000" (76.20mm) | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
|
|
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t-Global Technology |
21
|
3 days |
-
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MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X12.07X0.07MM
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PH3n | Heat Spreader | 3.000" (76.20mm) | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
|
|
|
t-Global Technology |
49
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X19.1X0.062MM
|
PH3n | Heat Spreader | 3.000" (76.20mm) | 0.750" (19.05mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
|
|
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t-Global Technology |
11
|
3 days |
-
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MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X19.1X0.07MM
|
PH3n | Heat Spreader | 3.000" (76.20mm) | 0.750" (19.05mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
|
|
|
t-Global Technology |
44
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X25.4X0.07MM
|
PH3n | Heat Spreader | 3.000" (76.20mm) | 1.000" (25.40mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
|
|
|
t-Global Technology |
24
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3 76.2X12.07X0.21MM
|
PH3 | Heat Spreader | 3.000" (76.20mm) | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
|
|
|
t-Global Technology |
9
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X25.4X0.062MM
|
PH3n | Heat Spreader | 4.000" (101.60mm) | 1.000" (25.40mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
|
|
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t-Global Technology |
7
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X25.4X0.07MM
|
PH3n | Heat Spreader | 4.000" (101.60mm) | 1.000" (25.40mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
|
|
|
t-Global Technology |
20
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3 76.2X25.4X0.21MM
|
PH3 | Heat Spreader | 3.000" (76.20mm) | 1.000" (25.40mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
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Wakefield-Vette |
Inquiry
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-
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MOQ: 1 MPQ: 1
|
HEATSINK DPAK SMT TIN PLATED
|
217 | Top Mount | 0.740" (18.80mm) | 0.600" (15.24mm) | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin |
