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Discover 10,319 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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TE Connectivity AMP Connectors |
290
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CFP RIDING
|
- | Board Level | Aluminum | 3.181" (80.80mm) | 4.390" (111.50mm) | SMD | 0.404" (10.27mm) | - | - | Black Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
117
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 57.9X59X11MM
|
- | Top Mount | Copper | 2.323" (59.00mm) | 2.280" (57.91mm) | BGA | 0.433" (11.00mm) | 1.90°C/W @ 200 LFM | 7.70°C/W | AavSHIELD 3C | ||
|
|
Advanced Thermal Solutions Inc. |
122
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X5.84MM FP
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 1.450" (36.83mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 25.25°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
117
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM FP
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 1.450" (36.83mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | 21.46°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
171
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X22.86MM FP
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 2.400" (60.96mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | 7.31°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
116
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 38.5X37.6X14MM
|
- | Top Mount | Copper | 1.480" (37.59mm) | 1.516" (38.50mm) | BGA | 0.551" (14.00mm) | 2.60°C/W @ 200 LFM | 15.90°C/W | AavSHIELD 3C | ||
|
|
Advanced Thermal Solutions Inc. |
93
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM FP
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 1.450" (36.83mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | 14.33°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
63
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X5.84MM FP
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 2.400" (60.96mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 18.94°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
27
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X5.84MM FP
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | 2.267" (57.60mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 22.48°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
62
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X17.78MM FP
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 1.450" (36.83mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | 17.42°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
89
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X17.78MM FP
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | 2.267" (57.60mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | 9.12°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
63
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM FP
|
pushPIN | Top Mount | Aluminum | 1.450" (36.83mm) | 2.267" (57.60mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | 6.42°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
79
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X9.5MM XCUT SFP
|
pushPIN | Top Mount | Aluminum | 1.772" (45.00mm) | 1.575" (40.01mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 28.22°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
91
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X12.7MM XCUT SFP
|
pushPIN | Top Mount | Aluminum | 1.772" (45.00mm) | 1.575" (40.01mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 26.60°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
96
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X12.7MM XCUT SFP
|
pushPIN | Top Mount | Aluminum | 1.969" (50.00mm) | 1.575" (40.01mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 27.03°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X9.5MM XCUT SFP
|
pushPIN | Top Mount | Aluminum | 1.969" (50.00mm) | 1.575" (40.01mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 27.93°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
61
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X11.43MM FP
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 2.400" (60.96mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | 14.56°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
99
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 54X54X12.7MM XCUT SFP
|
pushPIN | Top Mount | Aluminum | 2.126" (54.01mm) | 1.575" (40.01mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 26.99°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
92
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X17.78MM FP
|
pushPIN | Top Mount | Aluminum | 2.280" (57.90mm) | 2.400" (60.96mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | 10.03°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
97
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X40X9.5MM XCUT T766
|
pushPIN | Top Mount | Aluminum | 1.969" (50.00mm) | 1.575" (40.01mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 27.93°C/W @ 100 LFM | - | Blue Anodized |
