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Discover 12 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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CUI Inc. |
1,950
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 19.
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Board Level | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | ||
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CUI Inc. |
2,094
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 19.
|
Board Level | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | ||
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CUI Inc. |
2,094
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
Board Level | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | ||
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CUI Inc. |
995
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 2.3W ALUMINUM
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Board Level | Aluminum | 0.591" (15.00mm) | 0.504" (12.80mm) | TO-220 | 0.500" (12.70mm) | 2.3W @ 75°C | 11.04°C/W @ 200 LFM | 33.28°C/W | Black Anodized | ||
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CUI Inc. |
998
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 2.9W ALUMINUM
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Board Level | Aluminum | 0.748" (19.00mm) | 0.504" (12.80mm) | TO-220 | 0.500" (12.70mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | Black Anodized | ||
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CUI Inc. |
486
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.1W ALUMINUM
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Board Level | Aluminum | 0.625" (15.90mm) | 0.866" (22.00mm) | TO-220 | 0.440" (11.18mm) | 4.1W @ 75°C | 6.50°C/W @ 200 LFM | 18.34°C/W | Black Anodized | ||
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CUI Inc. |
360
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4W ALUMINUM
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Board Level | Aluminum | 1.500" (38.10mm) | 0.504" (12.80mm) | TO-220 | 0.500" (12.70mm) | 4.0W @ 75°C | 5.01°C/W @ 200 LFM | 18.63°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.1W ALUMINUM
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Board Level | Aluminum | 0.787" (20.00mm) | 0.775" (19.68mm) | TO-220 | 0.303" (7.70mm) | 4.1W @ 75°C | 7.05°C/W @ 200 LFM | 18.29°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 3.6W ALUMINUM
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Top Mount | Aluminum | 0.279" (7.10mm) | 0.787" (20.00mm) | TO-220 | 1.000" (25.40mm) | 3.6W @ 75°C | 7.45°C/W @ 200 LFM | 20.83°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 3.6W ALUMINUM
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Board Level | Aluminum | 0.748" (19.00mm) | 0.830" (21.08mm) | TO-220 | 0.394" (10.00mm) | 3.6W @ 75°C | 5.39°C/W @ 200 LFM | 20.59°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-252, 8 X
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Top Mount | Copper | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPAK) | 0.400" (10.16mm) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | Tin | ||
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 14.
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Top Mount | Copper | 0.590" (14.99mm) | 1.020" (25.91mm) | TO-263 (D2Pak) | 0.375" (9.52mm) | 2.1W @ 75°C | 8.15°C/W @ 200 LFM | 35.71°C/W | Tin |
